Schottky diode device with aluminum pickup of backside cathode
First Claim
1. A method for forming an integrated circuit package including a semiconductor chip having a passivation layer and a discrete electronic device, the method comprising:
- providing a discrete electronic device having a first surface and a second surface opposite the first surface, the first surface comprising a single terminal being a backside electrode of the discrete electronic device, and the second surface comprises a second terminal, at least one of the backside electrode and the second terminal of the discrete electronic device being electronically coupled to the semiconductor chip;
forming a metal pad on the top surface of the passivation layer of the semiconductor chip;
attaching substantially the entire first surface of the discrete electronic device to the metal pad using a conductive adhesive structure to form an electrical connection between the backside electrode of the discrete electronic device and the metal pad;
forming an electrical connection from the metal pad to one of a bond pad of the semiconductor chip or a package post of the integrated circuit package; and
encapsulating the semiconductor chip and the discrete electronic device to form the integrated circuit package.
10 Assignments
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Accused Products
Abstract
An integrated circuit package includes a semiconductor chip having a passivation layer forming the top surface of the semiconductor chip and a metal pad formed on the passivation layer and a discrete electronic device having a first terminal formed on a first surface and a second terminal formed on a second surface opposite the first surface of the discrete electronic device where the first surface of the discrete electronic device is attached to the metal pad using a conductive adhesive structure. The semiconductor chip and the discrete electronic device are encapsulated in an encapsulation material. An electrical connection is formed between the metal pad and one of a bond pad of the semiconductor chip or a package post of the integrated circuit package. In one embodiment, the metal pad is an aluminum pad and a metal line connects the metal pad to a bond pad of the semiconductor chip.
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Citations
13 Claims
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1. A method for forming an integrated circuit package including a semiconductor chip having a passivation layer and a discrete electronic device, the method comprising:
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providing a discrete electronic device having a first surface and a second surface opposite the first surface, the first surface comprising a single terminal being a backside electrode of the discrete electronic device, and the second surface comprises a second terminal, at least one of the backside electrode and the second terminal of the discrete electronic device being electronically coupled to the semiconductor chip; forming a metal pad on the top surface of the passivation layer of the semiconductor chip; attaching substantially the entire first surface of the discrete electronic device to the metal pad using a conductive adhesive structure to form an electrical connection between the backside electrode of the discrete electronic device and the metal pad; forming an electrical connection from the metal pad to one of a bond pad of the semiconductor chip or a package post of the integrated circuit package; and encapsulating the semiconductor chip and the discrete electronic device to form the integrated circuit package. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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Specification