Microfluidic device with controlled substrate conductivity

• US 7,195,986 B1
• Filed: 03/07/2003
• Issued: 03/27/2007
• Est. Priority Date: 03/08/2002
• Status: Active Grant

• Current Assignee: Caliper Life Sciences Incorporated (Revvity, Inc.)
• Original Assignee: Caliper Life Sciences Incorporated (Revvity, Inc.)
• Inventors: Bousse, Luc J., McReynolds, Richard J., Stern, Seth R.
• Primary Examiner(s): SINES, BRIAN J
• Application Number:
  US10/384,349
• Time in Patent Office: 1,481 Days
• Field of Search: 295/92, 295/921, 29/250.1, 438/48, 438/49, 438/372, 438/373, 438/505, 438/506, 438/510, 438/514, 422/50, 422/68.1, 422/81, 422/82, 422/100, 422/101, 422/102, 422/103, 422/104, 436/43, 436/63, 436/180
• US Class Current: 438/369
• CPC Class Codes: B01L 2200/12 Specific details about manufacturing devices
• CPC Class Codes: B01L 2300/0645 Electrodes
• CPC Class Codes: B01L 2400/0415 electrical forces, e.g. electrokinetic
• CPC Class Codes: B01L 3/502707 characterised by the manufacture of the container or its components by shaping or joining plastic parts B29C59/00, B29C65/00; by laminating B32B37/00; manufacture of microstructural devices in general B81C
• CPC Class Codes: B81B 2201/058 Microfluidics not provided for in B81B2201/051 - B81B2201/054
• CPC Class Codes: B81B 2203/0338 Channels
• CPC Class Codes: B81B 7/0006 Interconnects
• CPC Class Codes: B81C 1/00698 Electrical characteristics, e.g. by doping materials
• CPC Class Codes: B81C 2201/019 Bonding or gluing multiple substrate layers
• CPC Class Codes: G01N 27/44743 Introducing samples
• CPC Class Codes: G01N 27/44791 Microapparatus sample containers with integrated microfluidic structures B01L3/5027
• CPC Class Codes: Y10T 29/49 Method of mechanical manufacture
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 436/11 Automated chemical analysis
• CPC Class Codes: Y10T 436/2575 Volumetric liquid transfer

Abstract

A method to achieve controlled conductivity in microfluidic devices, and a device formed thereby. The method comprises forming a microchannel or a well in an insulating material, and ion implanting at least one region of the insulating material at or adjacent the microchannel or well to increase conductivity of the region.

Claims

1. In a microfluidic device, a method to achieve controlled conductivity within a layer of the microfluidic device, the method comprising:

forming a first microchannel in a first layer made of an insulating material;

forming at least one of a second microchannel and a well in the first layer; and

providing a conductive path between the first microchannel and the at least one of the second microchannel and the well by ion implanting at least one region of the first layer at or adjacent the at least one of the second microchannel and the well.

2. The method of claim 1, wherein the at least one region comprises the entire layer.

3. The method of claim 1, wherein the insulating material is a silica-based material.

4. The method of claim 1, wherein the insulating material is a polymer material.

5. The method of claim 1, wherein the first layer is a substrate of a microfluidic device.

6. The method of claim 1, wherein the first layer is a cover plate of a microfluidic device.

7. The method of claim 1, further comprising:

bonding the first layer to a second layer of the microfluidic device.

8. The method of claim 7, further comprising:

ion implanting at least one region of the second layer at or adjacent the at least one of the second microchannel and the well to thereby increase conductivity of the at least one region.

9. The method of claim 5, further comprising:

bonding the first layer to a second layer of the microfluidic device.

10. The method of claim 6, further comprising:

bonding the first layer to a second layer of the microfluidic device.

11. The method of claim 1, wherein the insulating material is glass.

12. The method of claim 11, further comprising:

bonding the first layer to a second layer of the microfluidic device.