Electrochemical fabrication methods using transfer plating of masks

• US 7,195,989 B2
• Filed: 05/07/2004
• Issued: 03/27/2007
• Est. Priority Date: 05/07/2003
• Status: Active Grant

• Current Assignee: Unique Concepts Ltd. (3M Company), Microfabrica Incorporated (Technoprobe S.P.A.)
• Original Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Inventors: Smalley, Dennis R., Lockard, Michael S.
• Primary Examiner(s): Toledo; Fernando L.
• Application Number:
  US10/841,383
• Publication Number:
  US 20050023148A1
• Time in Patent Office: 1,054 Days
• Field of Search: 438/466, 438/469, 438/652, 438/666, 257/E21.185, 257/E21.589
• US Class Current: 438/466
• CPC Class Codes: B33Y 10/00 Processes of additive manufacturing
• CPC Class Codes: C23C 18/1605 by masking
• CPC Class Codes: C23C 18/1657 Electroless forming, i.e. substrate removed or destroyed at the end of the process
• CPC Class Codes: C25D 1/003 3D structures, e.g. superposed patterned layers
• CPC Class Codes: C25D 5/022 using masking means
• CPC Class Codes: C25D 5/10 Electroplating with more than one layer of the same or of different metals for bearings C25D7/10
• CPC Class Codes: H01L 21/7682 the dielectric comprising air gaps
• CPC Class Codes: H01L 21/76838 characterised by the formation and the after-treatment of the conductors etching for patterning the conductors H01L21/3213

Abstract

Three-dimensional structures are electrochemically fabricated by depositing a first material onto previously deposited material through voids in a patterned mask where the patterned mask is at least temporarily adhered to a substrate or previously formed layer of material and is formed and patterned onto the substrate via a transfer tool patterned to enable transfer of a desired pattern of precursor masking material. In some embodiments the precursor material is transformed into masking material after transfer to the substrate while in other embodiments the precursor is transformed during or before transfer. In some embodiments layers are formed one on top of another to build up multi-layer structures. In some embodiments the mask material acts as a build material while in other embodiments the mask material is replaced each layer by a different material which may, for example, be conductive or dielectric.

Claims

1. A fabrication process for forming a multi-layer three-dimensional structure, comprising:

(a) forming and adhering a layer of material to a previously formed layer and/or to a substrate; and

(b) repeating the forming and adhering of (a) a plurality of times to build up a three-dimensional structure from a plurality of adhered layers;

wherein the formation of at least a given layer, comprises;

(1) selectively transferring a pre-patterned precursor of a masking material which is transformed into a solidified masking material of desired thickness and cross-sectional configuration and adhered to the substrate or a previously formed layer to form a mask, wherein the mask has at least one extended region of masking material through which at least one void extends, and wherein the masking material comprises a dielectric; and

(2) depositing a first material onto a portion of the substrate or previously formed layer through the at least one void in the mask to form a portion of the given layer from a deposited first material; and

(3) removing the masking material to leave at least one opening which extends through the deposited first material on the given layer;

(4) depositing a second material into the at least one opening through the deposited first material on the given layer to form a portion of the layer from a deposited second material; and

(5) planarizing the deposited first and second materials to establish a common level for the first and second materials.

2. The process of claim 1 further comprising depositing a seed layer into the at least one void in the mask prior to depositing the first material into the at least one void.

3. The process of claim 2 further comprising planarizing the first material and the masking material to a common level prior to removing the masking material to leave the at least one opening.

4. The process of claim 1 further comprising depositing a seed layer into the at least one opening prior to depositing the second material into the at least one opening.

5. The process of claim 1 wherein the formation of the given layer comprises the formation of a plurality of layers and (1)–

(5) are performed during the formation of each of the plurality of layers.

6. A fabrication process for forming a multi-layer three-dimensional structure, comprising:

(a) forming and adhering a layer of material to a previously formed layer and/or to a substrate; and

(b) repeating the forming and adhering of (a) a plurality of times to build up a three-dimensional structure from a plurality of adhered layers;

wherein the formation of at least a given layer, comprises;

(1) selectively transferring a pre-patterned mask material of desire thickness and cross-sectional configuration to a substrate or previously formed layer and adhering said mask material to the substrate or a previously formed layer to form a mask, wherein the mask has at least one extended region of mask material through which at least one void extends, and wherein the mask material comprises a dielectric; and

(2) depositing a first material onto a portion of the substrate or previously formed layer through the at least one void in the mask to form a portion of the given layer from a deposited first material; and

(3) removing the mask material to leave at least one opening which extends through the deposited first material on the given layer;

(4) depositing a second material into the at least one opening through the deposited first material on the given layer to form a portion of the layer from a deposited second material; and

(5) planarizing the deposited first and second materials to establish a common level for the first and second materials.

7. A fabrication process for forming a multi-layer three-dimensional structure, comprising:

(a) forming and adhering a layer of material to a previously formed layer; and

(b) repeating the forming and adhering of (a) at least one time to build up a three-dimensional structure from a plurality of adhered layers;

wherein the formation of at least a given layer, comprises;

(1) selectively transferring a pre-patterned precursor of a masking material which is transformed into a solidified dielectric masking material of desired thickness and cross-sectional configuration and adhered to a previously formed layer to form a mask, wherein the mask has at least one extended region of masking material through which at least one void extends; and

(2) electrodepositing a first material onto a portion of the previously formed layer through the at least one void in the mask to form a portion of the given layer from a deposited first material.

8. The process of claim 7 further comprising depositing a seed layer into the at least one void in the mask prior to depositing the first material into the at least one void.

9. The process of claim 8 further comprising planarizing the first material and the masking material to a common level.

10. The process of claim 7 wherein the formation of the given layer comprises the formation of a plurality of layers and (1)–

(2) are performed during the formation of each of the plurality of layers.

11. A fabrication process for forming a multi-layer three-dimensional structure, comprising:

(a) forming and adhering a layer of material to a previously formed layer; and

(b) repeating the forming and adhering of (a) at least one time to build up a three-dimensional structure from a plurality of adhered layers;

wherein the formation of at least a given layer, comprises;

(1) selectively transferring a pre-patterned, dielectric mask material of desired thickness and cross-sectional configuration to a previously formed layer and adhering said mask material to a previously formed layer to form a mask, wherein the mask has at least one extended region of mask material through which at least one void extends; and

(2) electrodepositing a first material onto a portion of the previously formed layer through the at least one void in the mask to form a portion of the given layer from a deposited first material.

12. A fabrication process for forming a three-dimensional structure, comprising:

(a) selectively transferring, in association with the formation of a given layer, a pre-patterned precursor of a masking material which is transformed into a solidified, dielectric masking material of desired thickness and cross-sectional configuration and adhered to a substrate or a previously formed layer to form a mask, wherein the mask has at least one extended region of mask material through which at least one void extends;

(b) electrodepositing a first material into the at least one void to form at least a portion of the three-dimensional structure; and

(c) destructively removing the mask from the substrate or previously formed layer.

13. A fabrication process for forming a three-dimensional structure, comprising:

(a) selectively transferring, in association with the formation of a given layer, a pre-patterned, dielectric mask, material of desired thickness and cross-sectional configuration to a substrate or previously formed layer and adhering said mask material to a substrate or a previously formed layer to form a mask, wherein the mask has at least one extended region of mask material through which at least one void extends;

(b) electrodepositing a first material into the at least one void to form at least a portion of the three-dimensional structure; and

(c) destructively removing the mask from the substrate or previously formed layer.