Stacked low profile cooling system and method for making same

• US 7,198,096 B2
• Filed: 01/15/2003
• Issued: 04/03/2007
• Est. Priority Date: 11/26/2002
• Status: Expired due to Fees

• Current Assignee: The Thermotek Incorporated
• Original Assignee: The Thermotek Incorporated
• Inventors: Quisenberry, Tony, Parish, Overton L. IV
• Primary Examiner(s): Leo; Leonard R.
• Application Number:
  US10/345,475
• Publication Number:
  US 20040099407A1
• Time in Patent Office: 1,539 Days
• Field of Search: 165/104.14, 165/104.21, 165/104.33, 361/700, 257/714, 257/715, 174/15.2, 174/16.3
• US Class Current: 165/104.33
• CPC Class Codes: F28D 15/0233 the conduits having a particular shape, e.g. non-circular cross-section, annular F28D15/0241, F28D15/0266 take precedence
• CPC Class Codes: F28D 2015/0225 Microheat pipes
• CPC Class Codes: G06F 1/203 for portable computers, e.g. for laptops
• CPC Class Codes: H01L 23/427 Cooling by change of state, e.g. use of heat pipes by liquefied gas H01L23/445
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A stacked array of low profile heat pipes each with a plurality of micro tubes extended therethrough. The stacked low profile heat pipes are placed into thermal connection with heat producing components. A heat transfer fluid is contained in the micro tubes of the low profile heat pipes and removes the heat from the heat producing components.

Claims

1. A cooling system for removing heat from at least one heat generating component, said cooling system comprising:

a plurality of low profile phase plane heat pipes having first and second end sections and disposed in thermal contact one with the other, said low profile phase plane heat pipes having a plurality of micro tubes disposed therein and having at least one fin stock disposed outwardly along a portion thereof;

a heat transfer fluid contained within said plurality of micro tubes;

a coupling element adapted for coupling said plurality of low profile phase plane heat pipes at said first end section thereof, said coupling element having a surface adapted for thermal contact with the heat generating component for removing heat therefrom; and

said phase plane heat pipes diverging outwardly one from the other beyond said first end section, and forming said second end section in increased spaced relationship relative to said first end section for accommodating said at least one fin stock in thermal contact along a portion thereof for facilitating enhanced thermal transfer therefrom.

2. A method of removing heat from at least one heat generating component, comprising the steps of:

providing a plurality of phase plane heat pipes having first and second end sections and each having a plurality of micro tubes disposed internally thereof and containing a heat transfer fluid therein;

coupling said plurality of heat pipes in thermal contact one with the other along said first end sections thereof with a coupling element to improve the thermal efficiency thereof;

diverging at least one of said plurality of phase plane heat pipes outwardly from another beyond said first end sections of said plurality of phase plane heat pipes;

mounting at least one fin stock along said outwardly diverged second end sections of said heat pipes for dissipating heat therefrom; and

securing said coupling element adjacent to said heat generating component.

3. A cooling system for removing heat from at least one heat generating component, said cooling system comprising:

a plurality of phase plane heat pipes;

a heat transfer fluid disposed within said heat pipes;

an evaporator section formed along a first end portion of said heat pipes for allowing said fluid to heat and evaporate therein;

a condenser section formed along a second end portion of said heat pipes for dissipating heat from said fluid and allowing the evaporated fluid to condense;

at least one fin stock secured outwardly of said heat pipes along at least a portion of said condenser section;

an adiabatic section of said heat pipes disposed between, and adapted for, transferring said fluid between said evaporator section and said condenser section;

a coupling element adapted for coupling said plurality of phase plane heat pipes in thermal contact one with the other to improve the thermal efficiency thereof; and

wherein at least one of said plurality of phase plane heat pipes diverges outwardly from at least one of said evaporator section and said adiabatic section for increasing the distance between said heat pipes along said condenser section and contiguous with said fin stock secured therealong.

4. The cooling system of claim 3, wherein said plurality of phase plane heat pipes are disposed in generally parallel-spaced relationship along said condenser section.

5. The cooling system of claim 3, wherein said plurality of phase plane heat pipes are disposed in generally parallel spaced relationship along said evaporator section.

6. The cooling system of claim 3, wherein the plurality of phase plane heat pipes are spaced substantially parallel to one another within at least a portion of the adiabatic section.

7. The cooling system of claim 3, wherein the plurality of phase plane heat pipes comprises three phase plane heat pipes.

8. The cooling system of claim 3, wherein at least one of the plurality of phase plane heat pipes is in thermal contact with the at least one fin stock for further facilitating condensation of the fluid.

9. The cooling system of claim 3, wherein a central one of the plurality of phase plane heat pipes is in thermal contact with fin stock on two outer surfaces of said central phase plane heat pipe.

10. The cooling system of claim 3, wherein an outer one of the plurality of phase plane heat pipes is in thermal contact with fin stock on one outer surface of said outer phase plane heat pipe.

11. The cooling system of claim 3, wherein at least one of the plurality of phase plane heat pipes diverges at an angle of between 0 and 90 degrees.

12. The cooling system of claim 3, wherein a central one of the plurality of phase plane heat pipes is non-divergent.

13. The cooling system of claim 3, wherein an outer one of the plurality of phase plane heat pipes diverges from a central one of the plurality of phase plane heat pipes.