Methods of reducing interlayer discontinuities in electrochemically fabricated three-dimensional structures

• US 7,198,704 B2
• Filed: 04/21/2004
• Issued: 04/03/2007
• Est. Priority Date: 04/21/2003
• Status: Active Grant

• Current Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Original Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Inventors: Smalley, Dennis R., Cohen, Adam L., Lockard, Michael S.
• Primary Examiner(s): Nguyen; Nam
• Assistant Examiner(s): Van; Luan V.
• Application Number:
  US10/830,262
• Publication Number:
  US 20040251142A1
• Time in Patent Office: 1,077 Days
• Field of Search: 205/118, 205/135, 205/170, 205/120, 205/122, 204/224.R, 204/224.M
• US Class Current: 205/118
• CPC Class Codes: B33Y 10/00 Processes of additive manufacturing
• CPC Class Codes: C23C 18/1605 by masking
• CPC Class Codes: C23C 18/1651 Two or more layers only obtained by electroless plating
• CPC Class Codes: C25D 1/003 3D structures, e.g. superposed patterned layers
• CPC Class Codes: C25D 5/02 Electroplating of selected surface areas
• CPC Class Codes: H01P 11/006 Manufacturing dielectric waveguides

Abstract

Disclosed methods reduce the discontinuities between individual layers of a structure that are formed at least in part using electrochemical fabrication techniques. Discontinuities may exist between layers of a structure as a result of up-facing or down-facing regions defined in data descriptive of the structure or they may exist as a result of building limitations, e.g., limitations that result in non-parallel orientation between a building axis and sidewall surfaces of layers. Methods for reducing discontinuities may be applied to all regions or only to selected regions of the structure. Methods may be tailored to improve the accuracy between an original design of the structure and the structure as fabricated or they may simply be used to smooth the discontinuities between layers. Methods may include deposition operations that selectively favor filling of the discontinuities and/or etching operations that selectively favor removal of material from protrusions that define discontinuities.

Claims

1. A method for electrochemically forming a three-dimensional structure from a plurality of adhered layers, comprising:

providing a substrate;

forming a layer comprising a structural material and a sacrificial material, wherein at least one of the structural material or sacrificial material is electrodeposited on to the substrate;

forming subsequent layers adhered to previously formed layers wherein either the quantization of layers results in unintended interlayer discontinuities or build processes result in offset features or non-vertical sidewall features; and

wherein prior to completing formation of all layers or after completing formation of all layers, performing at least one operation, comprising an etching operation, that results in reduction of quantization based interlayer discontinuities, offset features, or non-vertical sidewall features.

2. The method of claim 1 wherein the at least one operation operates, after removal of sacrificial material, on structural material located on a plurality of layers simultaneously.

3. The method of claim 2 wherein the at least one operation comprises and operation selected from the group consisting of a chemical etching operations and or an electrochemical etching operation.

4. The method of claim 1 wherein the at least one operation operates on one given layer at a time during formation of that given layer.

5. The method of claim 4 wherein the at least one operation operates on a first deposited material after the first deposited material is deposited to a height that is at least as great as a thickness of the given layer and prior to depositing a second material that will form a portion of the given layer.

6. The method of claim 4 wherein the structural material comprises a first deposited material and the sacrificial material comprises a second deposited material, wherein the first deposited material is selectively deposited into an opening in an adhered mask.

7. The method of claim 4 wherein the sacrificial material comprises a first deposited material and the structural material comprises a second deposited material, wherein the first deposited material is selectively deposited into an opening in an adhered mask.

8. The method of claim 4 wherein the at least one operation comprises a plurality of etching operations using masks of varied size that etch into the first deposited material on the given layer prior to depositing the second material.

9. The method of claim 1 wherein the plurality of layers are formed using a total of N distinct selective deposition operations or selective etching operations wherein one or more of the materials forming the layers are patterned, wherein photomasks are used to produce deposition or etching masks and where the number of photomasks used to produce the deposition or etching masks is less than N.

10. A method for electrochemically forming a three-dimensional structure, comprising:

providing a substrate;

forming a layer comprising a structural material and a sacrificial material, wherein at least one of the structural material or sacrificial material is electrodeposited on to the substrate;

forming subsequent layers adhered to previously formed layers wherein either the quantization of layers results in unintended interlayer discontinuities or build processes result in offset features or non-vertical sidewall features; and

wherein prior to completing formation of all layers or after completing formation of all layers, performing at least one operation, comprising a deposition operation, that results in the reduction of quantization based interlayer discontinuities, offset features, or non-vertical sidewall features.

11. The method of claim 10 wherein the at least one operation operates, after removal of sacrificial material, on structural material located on a plurality of layers simultaneously.

12. The method of claim 10 wherein the at least one operation comprises an operation selected from the group comprising:

an electrodeposition operation, an electroless deposition operation, a powder coating operation, electrophoretic deposition operation, and a spraying operation.

13. The method of claim 10 wherein the at least one operation operates on one given layer at a time during formation of that given layer.

14. The method of claim 13 wherein the at least one operation comprises depositing the first material in a plurality of operations where a mask size is varied and where after a second material is deposited to form part of the layer.

15. The method of claim 13 wherein the at least one operation operates on a first deposited material after the first deposited material is deposited to a height that is at least as great as a thickness of the given layer and prior to depositing a second material that will form a portion of the given layer.

16. The method of claim 13 wherein the at least one operation comprises a plurality of deposition operations using masks of varied size that build up the first deposited material on the given layer prior to depositing the second material.

17. A method for electrochemically forming a three-dimensional structure from a plurality of adhered layers, comprising:

providing a substrate;

forming a layer comprising a structural material and a sacrificial material, wherein at least one of the structural material or sacrificial material is electrodeposited on to the substrate;

forming subsequent layers adhered to previously formed layers wherein either the quantization of layers results in unintended interlayer discontinuities or build processes result in offset features or non-vertical sidewall features; and

wherein prior to completing formation of all layers or after completing formation of all layers, performing at least two operations, comprising an etching operation and a deposition operation, that result in reduction of quantization based interlayer discontinuities, offset features, or non-vertical sidewall features.

18. The method of claim 17 wherein the at least two operations operate, after removal of sacrificial material, on structural material located on a plurality of layers simultaneously.

19. The method of claim 17 wherein the at least two operations operate on one given layer at a time during formation of that given layer.

20. The method of claim 17 wherein the at least two operations comprise at least one etching operation followed by at least one deposition operation followed by at least one etching operation.