Method for edge sealing barrier films

• US 7,198,832 B2
• Filed: 04/22/2005
• Issued: 04/03/2007
• Est. Priority Date: 10/25/1999
• Status: Expired due to Term

• Current Assignee: Samsung Display Company Limited (Samsung Electronics Co. Ltd.)
• Original Assignee: Vitex Systems, Inc.
• Inventors: Burrows, Paul E., Graff, Gordon L., Mast, Eric S., Gross, Mark E., Martin, Peter M.
• Primary Examiner(s): Dye; Rene
• Assistant Examiner(s): HON, SOW FUN
• Application Number:
  US11/112,860
• Publication Number:
  US 20050202646A1
• Time in Patent Office: 711 Days
• Field of Search: 428 15- 155, 313479-480, 257/28, 429/137, 429/141, 438125-127
• US Class Current: 428/1.5
• CPC Class Codes: C09K 2323/05 Bonding or intermediate layer characterised by chemical composition, e.g. sealant or spacer
• CPC Class Codes: G02F 1/133337 Layers preventing ion diffusion, e.g. by ion absorption
• CPC Class Codes: H01L 23/562 Protection against mechanical damage H01L23/02, H01L23/28 take precedence
• CPC Class Codes: H01L 23/564 Details not otherwise provided for, e.g. protection against moisture getters H01L23/26
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/12044 OLED
• CPC Class Codes: H10K 50/844 Encapsulations
• CPC Class Codes: H10K 50/8445 multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
• CPC Class Codes: H10K 59/8731 multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
• CPC Class Codes: H10K 71/80 using temporary substrates
• CPC Class Codes: Y02E 60/10 Energy storage using batteries
• CPC Class Codes: Y10T 156/10 Methods of surface bonding and/or assembly therefor

Abstract

An edge-sealed, encapsulated environmentally sensitive device. The device includes at least one initial barrier stack, an environmentally sensitive device, and at least one additional barrier stack. The barrier stacks include at least one decoupling layer and at least one barrier layer. The environmentally sensitive device is sealed between the at least one initial barrier stack and the at least one additional barrier stack. A method of making the edge-sealed, encapsulated environmentally sensitive device is also disclosed.

Claims

1. An edge-sealed, encapsulated environmentally sensitive device comprising:

at least one initial barrier stack comprising at least one decoupling layer and at least one barrier layer, wherein a first decoupling layer of a first initial barrier stack has an area and wherein a first barrier layer of the first initial barrier stack has an area, the area of the first barrier layer of the first initial barrier stack being greater than the area of the first decoupling layer of the first initial barrier stack, and wherein the first barrier layer of the first initial barrier stack is in contact with a third barrier layer or an optional substrate, sealing the first decoupling layer of the first initial barrier stack between the first barrier layer of the first initial barrier stack and the third barrier layer or the optional substrate;

an environmentally sensitive device adjacent to the at least one initial barrier stack; and

at least one additional barrier stack adjacent to the environmentally sensitive device on a side opposite the at least one initial barrier stack, the at least one additional barrier stack comprising at least one decoupling layer and at least one barrier layer, wherein a first decoupling layer of a first additional barrier stack has an area and wherein a first barrier layer of the first additional barrier stack has an area, the area of the first barrier layer of the first additional barrier stack being greater than the area of the first decoupling layer of the first additional barrier stack, wherein the first barrier layer of the first additional barrier stack is in contact with a fourth barrier layer, sealing the first decoupling layer of the first additional barrier stack between the first barrier layer of the first additional barrier stack and the fourth barrier layer, and wherein at least one barrier layer of at least one initial barrier stack is in contact with at least one barrier layer of at least one additional barrier stack, sealing the environmentally sensitive device between the at least one initial barrier stack and the at least one additional barrier stack forming an environmentally sensitive device seal, wherein an oxygen transmission rate through the environmentally sensitive device seal is less than 0.005 cc/m²/day at 23°

C. and 0% relative humidity.

2. The edge-sealed, encapsulated environmentally sensitive device of claim 1 wherein the first initial barrier stack includes at least two barrier layers, and wherein the second barrier layer of the first initial barrier stack has an area greater than the area of the first decoupling layer of the first initial barrier stack and wherein the first and second barrier layers of the first initial barrier stack are in contact and seal the first decoupling layer of the first initial barrier stack between them.

3. The edge-sealed, encapsulated environmentally sensitive device of claim 1 wherein the edge-sealed, encapsulated environmentally sensitive device includes at least two initial barrier stacks, wherein a first barrier layer of a second initial barrier stack has an area greater than the area of the first decoupling layer of the first initial barrier stack and wherein the first barrier layer of the first initial barrier stack and the first barrier layer of the second initial barrier stack are in contact and seal the first decoupling layer of the first initial barrier stack between them.

4. The edge-sealed, encapsulated environmentally sensitive device of claim 1 wherein at least one of the decoupling layers is selected from organic polymers, inorganic polymers, organometallic polymers, hybrid organic/inorganic polymer systems, silicates, or combinations thereof.

5. The edge-sealed, encapsulated environmentally sensitive device of claim 1 wherein at least one of the barrier layers comprises a barrier material selected from metals, metal oxides, metal nitrides, metal carbides, metal oxynitrides, metal oxyborides, or combinations thereof.

6. The edge-sealed, encapsulated environmentally sensitive device of claim 1 wherein at least one of the barrier layers comprises a barrier material selected from opaque metals, opaque ceramics, opaque polymers, and opaque cermets, and combinations thereof.

7. The edge-sealed, encapsulated environmentally sensitive device of claim 1 wherein the environmentally sensitive device is selected from organic light emitting devices, liquid crystal displays, displays using electrophoretic inks, light emitting diodes, displays using light emitting polymers, electroluminescent devices, phosphorescent devices, organic solar cells, inorganic solar cells, thin film batteries, or thin film devices with vias, or combinations thereof.

8. A method of making an edge-sealed, encapsulated environmentally sensitive device comprising:

providing at least one initial barrier stack, the at least one initial barrier stack comprising at least one decoupling layer and at least one barrier layer, wherein a first decoupling layer of a first initial barrier stack has an area and wherein a first barrier layer of the first initial barrier stack has an area, the area of the first barrier layer of the first initial barrier stack being greater than the area of the first decoupling layer of the first initial barrier stack, and wherein the first barrier layer of the first initial barrier stack is in contact with a third barrier layer or an optional substrate, sealing the first decoupling layer of the first initial barrier stack between the first barrier layer of the first initial barrier stack and the third barrier layer or the optional substrate;

placing an environmentally sensitive device adjacent to the at least one initial barrier stack; and

placing at least one additional barrier stack adjacent to the environmentally sensitive device on a side opposite the at least one initial barrier stack, the at least one additional barrier stack comprising at least one decoupling layer and at least one barrier layer, wherein a first decoupling layer of a first additional barrier stack has an area and wherein a first barrier layer of the first additional barrier stack has an area, the area of the first barrier layer of the first additional barrier stack being greater than the area of the first decoupling layer of the first additional barrier stack, wherein the first barrier layer of the first additional barrier stack is in contact with a fourth barrier layer, sealing the first decoupling layer of the first additional barrier stack between the first barrier layer of the first additional barrier stack and the fourth barrier layer, and wherein at least one barrier layer of at least one initial barrier stack is in contact with at least one barrier layer of at least one additional barrier stack, sealing the environmentally sensitive device between the at least one initial barrier stack and the at least one additional barrier stack forming an environmentally sensitive device seal, wherein an oxygen transmission rate through the environmentally sensitive device seal is less than 0.005 cc/m²/day at 23°

C. and 0% relative humidity.

9. The method of claim 8 wherein the first initial barrier stack includes at least two barrier layers, and wherein the second barrier layer of the first initial barrier stack has an area greater than the area of the first decoupling layer of the first initial barrier stack and wherein the first and second barrier layers of the first initial barrier stack are in contact and seal the first decoupling layer of the first initial barrier stack between them.

10. The method of claim 8 wherein there are at least two initial barrier stacks, wherein a first barrier layer of a second initial barrier stack has an area greater than the area of the first decoupling layer of the first initial barrier stack and wherein the first barrier layer of the first initial barrier stack and the first barrier layer of the second initial barrier stack are in contact and seal the first decoupling layer of the first initial barrier stack between them.

11. The method of claim 8 wherein providing at least one initial barrier stack comprises depositing the at least one initial barrier stack adjacent to a substrate.

12. The method of claim 11 wherein depositing the at least one initial barrier stack adjacent to a substrate comprises depositing at least one decoupling layer before depositing at least one barrier layer.

13. The method of claim 11 wherein depositing the at least one initial barrier stack adjacent to a substrate comprises:

providing a mask with at least one opening;

depositing the first decoupling layer through the at least one opening in the mask; and

depositing the first barrier layer.

14. The method of claim 11 wherein depositing the at least one initial barrier stack adjacent to a substrate comprises:

depositing the first decoupling layer having an initial area of decoupling material which is greater than the area of the first decoupling layer;

etching the first decoupling layer having the initial area to remove a portion of the decoupling material so that the first decoupling layer has the area of the first decoupling layer; and

depositing the first barrier layer.

15. The method of claim 14 wherein etching the first decoupling layer comprises providing a solid mask over the first decoupling layer having the initial area of decoupling material, and etching the first decoupling layer having the initial area of decoupling material to remove the portion of the decoupling material outside the solid mask so that the first decoupling layer has the area of the first decoupling layer.

16. The method of claim 14 wherein the first decoupling layer is etched so that at least one edge of the first decoupling layer has a gradual slope.

17. The method of claim 14 wherein the first decoupling layer is etched using a reactive plasma.

18. The method of claim 17 wherein the reactive plasma is selected from O₂, CF₄, H₂, or combinations thereof.

19. The method of claim 8 further comprising depositing a ridge on the substrate before depositing the at least one barrier stack adjacent to the substrate, the ridge interfering with the deposition of the first decoupling layer so that the area of the first barrier layer is greater than the area of the first decoupling layer and the first decoupling layer is sealed by the first barrier layer within the area of the first barrier layer.

20. The method of claim 8 wherein placing the at least one barrier stack adjacent to the substrate comprises laminating the at least one barrier stack adjacent to the substrate.

21. The method of claim 20 wherein the at least one barrier stack is laminated adjacent to the substrate using a process selected from heating, soldering, using an adhesive, ultrasonic welding, and applying pressure.