Strained finFETs and method of manufacture

• US 7,198,995 B2
• Filed: 12/12/2003
• Issued: 04/03/2007
• Est. Priority Date: 12/12/2003
• Status: Active Grant

• Current Assignee: Globalfoundries US Incorporated (GlobalFoundries, Inc.)
• Original Assignee: International Business Machines Corporation
• Inventors: Chidambarrao, Dureseti, Dokumaci, Omer H., Gluschenkov, Oleg G.
• Primary Examiner(s): Booth; Richard A.
• Application Number:
  US10/733,378
• Publication Number:
  US 20050130358A1
• Time in Patent Office: 1,208 Days
• Field of Search: 438/157, 438/275, 438/285
• US Class Current: 438/157
• CPC Class Codes: H01L 21/823807 with a particular manufacturing method of the channel structures, e.g. channel implants, halo or pocket implants, or channel materials
• CPC Class Codes: H01L 21/823821 with a particular manufacturing method of transistors with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
• CPC Class Codes: H01L 21/845 including field-effect transistors with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
• CPC Class Codes: H01L 27/1211 combined with field-effect transistors with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
• CPC Class Codes: H01L 29/66795 with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
• CPC Class Codes: H01L 29/7842 means for exerting mechanical stress on the crystal lattice of the channel region, e.g. using a flexible substrate variation of the composition of the channel H01L29/1054
• CPC Class Codes: H01L 29/785 having a channel with a horizontal current flow in a vertical sidewall of a semiconductor body, e.g. FinFET, MuGFET
• CPC Class Codes: H01L 29/78684 having a semiconductor body comprising semiconductor materials of Group IV not being silicon, or alloys including an element of the group IV, e.g. Ge, SiN alloys, SiC alloys H01L29/7869 takes precedence

Abstract

A semiconductor structure and method of manufacturing is provided. The method of manufacturing includes forming shallow trench isolation (STI) in a substrate and providing a first material and a second material on the substrate. The first material and the second material form a first island and second island at an pFET region and a nFET region, respectively. A tensile hard mask is formed on the first and the second island layer prior to forming finFETs. An Si epitaxial layer is grown on the sidewalls of the finFETs with the hard mask, now a capping layer which is under tension, preventing lateral buckling of the nFET fin.

Claims

1. A method of manufacturing a structure, comprising the steps of:

forming a first island of material having a first lattice constant;

forming a second island of material having a second lattice constant;

providing a mask over the first island and the second island which is used to form a tensile capping layer; and

forming at least a first finFET and a second finFET from the first island and the second island,

wherein the tensile capping layer prevents buckling of one of the first and second finFET.

2. The method of claim 1, wherein the first island is comprised of SiGe material and the second island is comprised of Si:

C material and the mask is a nitride hard mask.

3. The method of claim 1, wherein the first and second finFET are formed by sidewall image transfer and etching.

4. The method of claim 1, further comprising selectively growing an Si epitaxial sidewall layer on sidewalls of the first finFET and the second finFET, wherein the tensile capping layer prevents buckling of the at least second finFET during the growth of the Si epitaxial sidewall layer thereon.

5. The method of claim 1, wherein:

etching forms the tensile capping layer from the mask on the first and second finFET;

the first finFET is comprised of SiGe and is placed in a tensile stress; and

the second finFET is comprised of is Si;

C and is placed in a compressive stress.

6. The method of claim 5, wherein the tensile capping layer prevents collapse or buckling of the Si:

C finFET.

7. The method of claim 1, further comprising:

forming shallow trench isolation (STI) in a substrate;

mixing the material into the substrate to form the first island and the second island by a thermal anneal process at a pFET region and a nFET region, respectively; and

wherein the STI relaxes and facilitates the relaxation of the first island and the second island.

8. The method of claim 1, wherein the first island is formed by one of depositing and growing Ge material and the second island is formed by one of depositing and growing Si:

C or C material, the first island and the second island have a different relaxed crystal lattice.

9. The method of claim 4, wherein the Si epitaxial sidewall layer has a different lattice constant than the first material and the second material such that the selectively grown Si epitaxial sidewall layer will strain tensilely and compressively on the first island and the second island, respectively.

10. The method of claim 4, wherein the first finFET has a lattice constant a≧

aSi and the second finFET has a lattice constant a≦

aSi.

11. The method of claim 1, wherein the first island is comprised substantially of SiGe and the second island is comprised substantially of Si:

C and an epitaxially grown sidewall layer is grown on an etched SiGe finFET and Si;

C finFET formed respectively from the SiGe island and the Si;

C island, the SiGe finFET and the Si;

C finFET is placed under a tensile stress and a compressive stress, respectively, by virtue of lattice matching of the epitaxially grown sidewall layer to the SiGe and Si;

C finFET.

12. A method of manufacturing a semiconductor structure, comprising the steps of:

forming shallow trench isolation (STI) in a substrate with a first material;

forming a first island associated with a pFET region and a second island associated with an nFET region;

providing a hard mask in tensile stress over the pFET region and the nFET region;

forming a pFET fin and an nFET fin with a capping layer of the hard mask in the pFET region and the nFET region, respectively; and

growing sidewalls on the pFET fin and the nFET fin, wherein the capping layer prevents buckling of the nFET fin during sidewall growth.

13. The method of claim 12, wherein the pFET fin is made from a material comprised from SiGe and the nFET fin is made from a material comprised from one of Si:

C or C.

14. The method of claim 13, wherein the SiGe becomes tensilely strained and the Si:

C becomes compressively strained and the hard mask prevents buckling of the nFET fin by substantially countering the compressive stress form by sidewall formation thereon.

15. The method of claim 12, further comprising relaxing the STI and which facilitates relaxation of the first island and the second island during the thermally annealing step.

16. The method of claim 12, wherein the sidewalls are comprised of Si which has a different lattice constant than the pFET fin and the nFET fin such that the Si sidewall will tensilely and compressively stress the pFET fin and the nFET fin, respectively.

17. A method, comprising:

forming a structure comprising a shallow trench isolation (STI) between a first region and a second region;

depositing an epitaxial Ge material over a surface of structure;

providing an nFET hard mask on a portion of the Ge layer over the first region;

etching an exposed portion of the Ge layer;

stripping the nFET hard mask;

depositing a Si;

C or C layer over the epitaxially deposited Ge material over the second region;

depositing a pFET hard mask on a portion of the Si;

C or C layer on the first region;

etching exposed portions of the Si;

C or C layer;

stripping the pFET mask; and

annealing the formed structure,

wherein during the annealing, for an nFET device, the deposited Ge layer is mixed into an underlying SOI film to form an island of substantially SiGe material and, for a pFET device, the deposited Si;

C layer is mixed into the underlying SOI film forming an island of substantially Si;

C material.

18. The method of claim 17, wherein the annealing takes place at about 1200°

C. to 1350°

C. between 1 hour and 10 hours.

19. The method of claim 17, wherein the pFET hard mask is a nitride hard mask formed using spin-on coating, CVD, plasma-assisted CVD, ultrahigh vacuum chemical vapor deposition (UHVCVD), rapid thermal chemical vapor deposition (RTCVD), or limited reaction processing CVD (LRPCVD).

20. The method of claim 17, wherein the depositing of the Si:

C or C layer is by ultrahigh vacuum chemical vapor deposition (UHVCVD), rapid thermal chemical vapor deposition (RTCVD), or limited reaction processing CVD (LRPCVD) and other like processes.

21. The method of claim 20, wherein a thickness of the Si:

C or C material is between 5 to 50 nanometers.

22. The method of claim 20, wherein the Ge layer has a percentage of Ge of less than 25% for the nFET device which does not cause defects in the structure.

23. The method of claim 22, wherein, due to the annealing, the STI relaxes and facilitates the relaxation of the SiGe island and the Si:

C island.

24. The method of claim 17, wherein the SiGe island and the Si:

C island have different relaxed crystal lattice which yield a substrate with small crystal islands.

25. The method of claim 24, wherein the relaxation of the SiGe island and the Si:

C island improves performance as compared to blanket (SiGe or Si;

C) substrates.

26. The method of claim 17, wherein the Ge layer is selectively etched using RIE, wet or dry etching.