Camera module fabrication method including singulating a substrate

• US 7,199,359 B2
• Filed: 09/21/2006
• Issued: 04/03/2007
• Est. Priority Date: 12/08/1999
• Status: Expired due to Term

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Webster, Steven
• Primary Examiner(s): Le, Que T.
• Application Number:
  US11/526,168
• Publication Number:
  US 20070012864A1
• Time in Patent Office: 194 Days
• Field of Search: 250/239, 250/208.1, 250/216, 257 81- 84, 257433-440
• US Class Current: 250/239
• CPC Class Codes: G02B 7/02 for lenses supports for magnifying lenses G02B25/002
• CPC Class Codes: G02B 7/022 lens and mount having complementary engagement means, e.g. screw/thread
• CPC Class Codes: H01L 2224/32013 the layer connector being larger than the bonding area, e.g. bond pad
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14627 Microlenses
• CPC Class Codes: H01L 27/14636 Interconnect structures
• CPC Class Codes: H01L 27/14683 Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof not peculiar thereto H01L21/00
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15787 Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 31/0203 : Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/0232 : Optical elements or arrangements associated with the device H01L31/0236 takes precedence; for photovoltaic cells H01L31/054; for photovoltaic modules H02S40/20
• CPC Class Codes: H01L 31/02325 : the optical elements not being integrated nor being directly associated with the device
• CPC Class Codes: H04N 23/54 : Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/55 : Optical parts specially adapted for electronic image sensors; Mounting thereof
• CPC Class Codes: H04N 23/57 : Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
• CPC Class Codes: Y10T 29/49002 : Electrical device making

Abstract

An image sensor package includes an image sensor, a window, and a molding, where the molding includes a lens holder extension portion extending upwards from the window. The lens holder extension portion includes a female threaded aperture extending from the window such that the window is exposed through the aperture. A lens is supported in a threaded lens support. The threaded lens support is threaded into the aperture of the lens holder extension portion. The lens is readily adjusted relative to the image sensor by rotating the lens support.

Claims

1. A method comprising:

coupling a first image sensor to a first substrate;

coupling a second image sensor to a second substrate, the second substrate being integrally connected to the first substrate;

coupling a first lens mount to the first substrate around the first image sensor;

coupling a second lens mount to the second substrate around the second image sensor; and

singulating the first substrate from the second substrate.

2. The method of claim 1 wherein the singulating forms a first camera module and a second camera module.

3. The method of claim 2 wherein the first camera module comprises the first substrate, the first image sensor and the first lens mount.

4. The method of claim 3 wherein the second camera module comprises the second substrate, the second image sensor and the second lens mount.

5. The method of claim 2 wherein the first image sensor is coupled to a first surface of the first substrate with a first adhesive and the second image sensor is coupled to a first surface of the second substrate with a second adhesive.

6. The method of claim 5 further comprising:

wirebonding bond pads of the first image sensor to traces on the first surface of the first substrate; and

wirebonding bond pads of the second image sensor to traces on the first surface of the second substrate.

7. The method of claim 6 wherein the first substrate further comprises:

traces on a second surface of the first substrate; and

vias electrically coupling the traces on the second surface of the first substrate with the traces on the first surface of the first substrate; and

wherein the second substrate further comprises;

traces on a second surface of the second substrate; and

vias electrically coupling the traces on the second surface of the second substrate with the traces on the first surface of the second substrate.

8. The method of claim 7 further comprising:

forming first means for electrically connecting the first camera module to a first larger substrate, the first means for electrically connecting being electrically connected to the traces on the second surface of the first substrate; and

forming second means for electrically connecting the second camera module to a second larger substrate, the second means for electrically connecting being electrically connected to the traces on the second surface of the second substrate.

9. The method of claim 8 wherein the first means for electrically connecting comprises a first land grid array and wherein the second means for electrically connecting comprises a second land grid array.

10. The method of claim 8 wherein the first means for electrically connecting comprises a first ball grid array and wherein the second means for electrically connecting comprises a second grid array.

11. The method of claim 8 further comprising:

electrically connecting the first camera module to the first larger substrate; and

electrically connecting the second camera module to the second larger substrate.

12. The method of claim 1 wherein the first lens mount is coupled to a first surface of the first substrate with a first adhesive and the second lens mount is coupled to a first surface of the second substrate with a second adhesive.

13. A method comprising:

coupling image sensors to substrates, the substrates being integrally connected together;

coupling lens mounts to the substrates around the image sensors; and

singulating the substrates to form a plurality of camera modules.

14. The method of claim 13 wherein each of the camera modules comprises a substrate, an image sensor and a lens mount.

15. The method of claim 13 wherein the image sensors are coupled to first surfaces of the substrates with adhesives.

16. The method of claim 15 further comprising:

wirebonding bond pads of the image sensors to traces on the first surfaces of the substrates.

17. The method of claim 16 wherein the substrates further comprise:

traces on second surfaces of the substrates; and

vias electrically coupling the traces on the second surfaces of the substrates with the traces on the first surfaces of the substrates.

18. The method of claim 17 further comprising:

forming means for electrically connecting the camera modules to larger substrates, the means for electrically connecting being electrically connected to the traces on the second surfaces of the substrates, wherein the means for electrically connecting are selected from the group consisting of land grid arrays and ball grid arrays.

19. The method of claim 18 further comprising:

electrically connecting the camera modules to the larger substrates.

20. A method comprising:

coupling image sensors to first surfaces of substrates with adhesives, the substrates being integrally connected together, wherein the substrates comprise;

traces on the first surfaces of the substrates

traces on second surfaces of the substrates; and

vias electrically coupling the traces on the second surfaces of the substrates with the traces on the first surfaces of the substrates;

electrically connecting bond pads of the image sensors to the traces on the first surfaces of the substrates with bond wires;

coupling lens mounts to the substrates around the image sensors with adhesives;

inserting lens barrels into the lens mounts;

singulating the substrates to form a plurality of camera modules;

rotating the lens barrels to focus the camera modules; and

securing the lens barrels to the lens mounts.