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Camera module fabrication method including singulating a substrate

  • US 7,199,359 B2
  • Filed: 09/21/2006
  • Issued: 04/03/2007
  • Est. Priority Date: 12/08/1999
  • Status: Expired due to Term
First Claim
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1. A method comprising:

  • coupling a first image sensor to a first substrate;

    coupling a second image sensor to a second substrate, the second substrate being integrally connected to the first substrate;

    coupling a first lens mount to the first substrate around the first image sensor;

    coupling a second lens mount to the second substrate around the second image sensor; and

    singulating the first substrate from the second substrate.

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