Optoelectronic semiconductor component

• US 7,199,454 B2
• Filed: 12/02/2004
• Issued: 04/03/2007
• Est. Priority Date: 09/29/1995
• Status: Expired due to Fees

• Current Assignee: OSRAM Licht AG (Ams-Osram AG)
• Original Assignee: OSRAM GmbH (Ams-Osram AG)
• Inventors: Brunner, Herbert, Schellhorn, Franz, Arndt, Karlheinz, Waitl, Gu
• Primary Examiner(s): LOUIE, WAI SING
• Application Number:
  US11/002,959
• Publication Number:
  US 20050116238A1
• Time in Patent Office: 852 Days
• Field of Search: None
• US Class Current: 257/675
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 31/02005 for device characterised by at least one potential jump barrier or surface barrier
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/0232 Optical elements or arrangements associated with the device H01L31/0236 takes precedence; for photovoltaic cells H01L31/054; for photovoltaic modules H02S40/20
• CPC Class Codes: H01L 31/024 Arrangements for cooling, heating, ventilating or temperature compensation for photovoltaic devices H01L31/052
• CPC Class Codes: H01L 33/486 adapted for surface mounting
• CPC Class Codes: H01L 33/60 Reflective elements
• CPC Class Codes: H01L 33/642 characterized by the shape
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body

Abstract

A radiation-emitting and/or radiation-receiving semiconductor component in which a radiation-emitting and/or radiation-receiving semiconductor chip is secured on a chip carrier part of a lead frame. The chip carrier part forms a trough in the region in which the semiconductor chip is secured wherein the inner surface of the trough is designed in such a way that it constitutes a reflector for the radiation emitted and/or received by the semiconductor chip.

Claims

1. A semiconductor component which performs at least one of a radiation-emitting function and a radiation-receiving function, comprising:

a chip carrier part;

a base body surrounding at least a partial region of the chip carrier part;

a semiconductor chip which performs at least one of a radiation-emitting and radiation-receiving function and which is secured on the chip carrier part, and

a radiation permeable encapsulation covering the semiconductor chip;

said chip carrier part projecting through the underside of said base body and being utilized for at least one of an electrical connection and a thermal connection.

2. The semiconductor component of claim 1 further comprising a trough structure defining a recess around said semiconductor chip and providing a reflective inner surface.

3. The semiconductor component of claim 2 wherein said trough structure is part of said chip carrier part.

4. The semiconductor component of claim 1 wherein said base body is formed of radiation impermeable material.

5. The semiconductor component of claim 1, further comprising a connection part being arranged at a distance from the chip carrier part and being electrically connected to the semiconductor chip and having at least one external connection which projects from the base body.

6. The semiconductor component of claim 5, wherein the chip carrier part is electrically connected to the semiconductor chip and comprises at least two external connections that project from the base body.

7. The semiconductor component of claim 6, wherein the two external connections of the chip carrier part project from the base body at opposite sides.

8. The semiconductor component of claim 1, wherein the chip carrier part is electrically connected to the semiconductor chip and comprises at least two external connections that project from the base body.

9. The semiconductor component of claim 8, wherein the two external connections of the chip carrier part project from the base body at opposite sides.

10. The semiconductor component of claim 1, wherein the chip carrier part projects from a back face of the base body opposite the semiconductor chip.

19. The semiconductor component of claim 1, wherein the radiation permeable encapsulation covers and seals the semiconductor chip.

11. A semiconductor component which performs at least one of a radiation-emitting function and a radiation-receiving function, comprising:

a lead frame having a chip carrier part and a connection part;

a semiconductor chip which performs at least one of a radiation-emitting and radiation-receiving function and which is secured on the chip carrier part; and

an encapsulation covering the semiconductor chip and at least a partial region of the chip carrier part,

wherein the chip carrier part is electrically connected to the semiconductor chip and comprises at least two external connections that project from the encapsulation, and

wherein the connection part is arranged at a distance from the chip carrier part, is electrically connected to the semiconductor chip, and comprises at least one external connection that projects from the encapsulation.

12. The semiconductor component of claim 11, wherein the two external connections of the chip carrier part project from the encapsulation at opposite sides.

13. The semiconductor component of claim 12, wherein the connection part comprises at least two external connections that projects from the encapsulation.

14. The semiconductor component of claim 13, wherein the two external connections of the connection part project from the encapsulation at opposite sides.

15. The semiconductor component of claim 11, wherein the connection part comprises at least two external connections that projects from the encapsulation.

16. The semiconductor component of claim 11, wherein said encapsulation further comprises a base body having formed a recess therein and a radiation-permeable window arranged in the recess and wherein the semiconductor chip is positioned within the recess.

17. The semiconductor component of claim 16, wherein the recess comprises an inner surface that is coated with reflection-enhancing material.

18. The semiconductor component of claim 11, wherein the encapsulation is formed completely of a radiation-permeable material.

20. The semiconductor component of claim 11, wherein the radiation permeable encapsulation covers and seals the semiconductor chip.