Injection moulded product and a method for its manufacture
First Claim
Patent Images
1. An injection moulded product comprising:
- a carrier web layer which is a film selected from the group consisting of polyester and biaxially oriented polypropylene;
a circuitry pattern and an integrated circuit on the surface of the carrier web layer;
a melted intermediate thermoplastic layer having a first and an opposite second surface, the first surface overlying and bonded to the carrier web; and
an injection moulded layer attached to the second surface of the intermediate layer, the intermediate layer between the carrier web layer and the injection molded layer, and the intermediate layer being melted during an injection moulding to attach it to the injection moulded layer.
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Abstract
The invention relates to an injection moulded product comprising an attached body which has been attached by an intermediate layer. The body has been attached to the injection moulded product by an intermediate layer attached to the body prior to the injection moulding. The invention also relates to a method for the manufacture of an injection moulded product comprising a body which has been attached by an intermediate layer.
146 Citations
19 Claims
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1. An injection moulded product comprising:
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a carrier web layer which is a film selected from the group consisting of polyester and biaxially oriented polypropylene; a circuitry pattern and an integrated circuit on the surface of the carrier web layer; a melted intermediate thermoplastic layer having a first and an opposite second surface, the first surface overlying and bonded to the carrier web; and an injection moulded layer attached to the second surface of the intermediate layer, the intermediate layer between the carrier web layer and the injection molded layer, and the intermediate layer being melted during an injection moulding to attach it to the injection moulded layer. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A smart card comprising:
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a carrier web layer which is a film selected from the group consisting of polyester and biaxially oriented polypropylene; a circuitry pattern; an integrated circuit on a chip attached to the circuitry pattern, the circuitry pattern on the surface of the carrier web layer; a melted intermediate thermoplastic layer overlying the surface of the carrier web with the circuitry pattern; and an injection moulded layer, the injection moulded layer bonded to the carrier web layer by the intermediate layer which is between the injection moulded layer and the carrier web layer, the intermediate layer having been melted during an injection moulding to bond the carrier web layer to the injection molded layer to provide the smart card. - View Dependent Claims (8, 9, 10, 11)
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12. An injection moulded radio frequency identification circuit product comprising:
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a carrier film substrate selected from the group consisting of polyester and biaxially oriented polypropylene; a circuitry pattern and an integrated circuit on the surface of the carrier film substrate; an intermediate layer over and under the carrier film substrate, each intermediate layer selected from the group consisting of a melted thermoplastic extruded layer and a melted thermoplastic adhesive bonding film; and an injection moulded body overlying and attached to the intermediate layers, the intermediate layers between the carrier web layer and the injection molded body, and the intermediate layers having been melted to bond the carrier film substrate to the injection moulded body. - View Dependent Claims (13, 14)
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15. A smart card comprising:
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a carrier web layer film selected from the group consisting of polyester and biaxially oriented polypropylene; a circuitry pattern; an integrated circuit on a chip attached to the circuitry pattern, the circuitry pattern on the surface of the carrier web layer film; an extruded intermediate thermoplastic layer overlying the surface of the carrier web film with the circuitry pattern; and an injection moulded layer, the injection moulded layer bonded to the carrier web layer film by the intermediate layer which is between the injection moulded layer and the carrier web layer film, the intermediate layer having been an extruded thermoplastic film extruded over the carrier web layer film and then melted to bond the carrier web layer film to the injection molded layer during an injection moulding of the injection moulded layer to provide the smart card.
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16. An injection moulded product comprising:
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a carrier web layer film selected from the group consisting of polyester and biaxially oriented polypropylene; a circuitry pattern; an integrated circuit on a chip attached to the circuitry pattern, the circuitry pattern on the surface of the carrier web layer film; a melted extruded thermoplastic film, the melted extruded film overlying the surface of the carrier web film with the circuitry pattern; and an injection moulded layer, the injection moulded layer bonded to the carrier web layer by the extruded melted thermoplastic film, the melted extruded thermoplastic film between the injection moulded layer and the carrier web layer, the melted extruded thermoplasic film melted during the injection moulding of the injection moulded layer to bond the carrier web layer to the injection molded layer. - View Dependent Claims (17)
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18. An injection moulded product comprising:
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a carrier web layer which is a film selected from the group consisting of polyester and biaxially oriented polypropylene; a circuitry pattern; an integrated circuit on a chip attached to the circuitry pattern, the circuitry pattern on the surface of the carrier web layer film; a melted thermoplastic adhesive bonding film selected from the group consisting of polyolefin, polyurethane and polyester, the melted film overlying the surface of the carrier web film with the circuitry pattern; and an injection moulded layer, the injection moulded layer bonded to the carrier web layer film by the melted thermoplastic adhesive bonding film, the melted thermoplastic adhesive bonding film between the injection moulded layer and the carrier web layer film, the melted thermoplasic adhesive bonding film melted during the injection moulding of the injection moulded layer to bond the carrier web layer to the injection molded layer. - View Dependent Claims (19)
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Specification