Wireless device with distributed load

• US 7,199,762 B2
• Filed: 08/24/2005
• Issued: 04/03/2007
• Est. Priority Date: 08/24/2005
• Status: Active Grant

• Current Assignee: Google Technology Holdings LLC (Alphabet Inc.)
• Original Assignee: Motorola, Inc. (Motorola Solutions, Inc.)
• Inventors: Napoles, Adrian, Liu, Hongwei, White, Benjamin O.
• Primary Examiner(s): LE, HOANGANH T
• Application Number:
  US11/210,324
• Publication Number:
  US 20070052596A1
• Time in Patent Office: 587 Days
• Field of Search: 343/702, 343/700.MS, 343/846, 343/848, 455/575.1, 455/575.3
• US Class Current: 343/702
• CPC Class Codes: H01Q 1/243 with built-in antennas
• CPC Class Codes: H01Q 9/42 with folded element, the folded parts being spaced apart a small fraction of the operating wavelength
• CPC Class Codes: H04M 1/0214 Foldable telephones, i.e. with body parts pivoting to an open position around an axis parallel to the plane they define in closed position combined with translation movement H04M1/0235
• CPC Class Codes: H05K 1/0237 High frequency adaptations H05K1/0216 takes precedence
• CPC Class Codes: H05K 1/0239 Signal transmission by AC coupling
• CPC Class Codes: H05K 1/14 Structural association of two or more printed circuits providing electric connection to or between printed circuits H05K1/11, H01R12/00
• CPC Class Codes: H05K 1/148 Arrangements of two or more hingeably connected rigid printed circuit boards, i.e. connected by flexible means
• CPC Class Codes: H05K 2201/09318 Core having one signal plane and one power plane

Abstract

A wireless device (100) includes a first circuit board (102), a second circuit board (104), and a distributed load (106) having an inductive coupling (112) and a capacitive coupling (114). The inductive coupling (112) and the capacitive coupling (114) form a parallel resonance at predefined frequencies of interest. The second circuit board (104) includes an antenna (116) for receiving and transmitting radio waves.

Claims

1. A wireless device comprising:

a first circuit board with a first ground plane;

a second circuit board with an antenna and a second ground plane;

an inductive coupling between the first ground plane and the second ground plane; and

a capacitive coupling between the first ground plane and the second ground plane,

wherein the inductive coupling and the capacitive coupling form a parallel resonance at a frequency of interest.

2. The wireless device of claim 1, wherein the capacitive coupling comprises an air gap.

3. The wireless device of claim 2, wherein the air gap is between a conductive finger physically and electrically coupled to the second ground plane and a conductive barrel physically and electrically coupled to the first ground plane.

4. The wireless device of claim 2, wherein the air gap is between the first ground plane and a conductive patch physically and electrically coupled to the second ground plane.

5. The wireless device of claim 1, wherein the capacitive coupling comprises a patch physically and electrically coupled to the second ground plane and capacitively coupled to the first ground plane at the frequency of interest.

6. The wireless device of claim 5, wherein the patch comprises a material with a high coefficient of conductivity.

7. The wireless device of claim 1, wherein the inductive coupling is physically and electrically coupled to the first ground plane and the second ground plane at the frequency of interest.

8. The wireless device of claim 1, further comprising a first hinge between the first circuit board and the second circuit board.

9. The wireless device of claim 8, wherein the capacitive coupling goes through the first hinge.

10. The wireless device of claim 8, further comprising a second hinge between the first circuit board and the second circuit board.

11. The wireless device of claim 10, wherein the inductive coupling goes through the second hinge.

12. The wireless device of claim 1, wherein the antenna comprises a folded J antenna.

13. The wireless device of claim 1, wherein the antenna is located along a first edge of the second circuit board.

14. The wireless device of claim 13, wherein a first hinge is located along a second edge of the second circuit board, the second edge being opposite to the first edge.

15. The wireless device of claim 14, wherein the capacitive coupling goes through the first hinge.

16. The wireless device of claim 14, further comprising a second hinge located on the second edge of the second circuit board.

17. The wireless device of claim 16, wherein the inductive coupling goes through the second hinge.

18. The wireless device of claim 1, wherein the wireless device comprises a multi-band communication device.

19. The wireless device of claim 1, wherein the inductive coupling comprises a lumped element.

20. The wireless device of claim 1, wherein the capacitive coupling comprises a lumped element.