Electrical contact method and structure for deflection devices formed in an array configuration
First Claim
1. A spatial light modulator adapted to reflect incident light, the spatial light modulator comprising:
- a first substrate comprising a bias grid;
a bias electrode array coupled to the first substrate and electrically coupled to the bias grid;
a dielectric bond pad array coupled to the bias electrode array;
a standoff region array coupled to the dielectric bond pad array, the standoff region array comprising a plurality of standoff regions;
a plurality of mirror plates having an upper surface, the plurality of mirror plates flexibly coupled to the standoff region array; and
an electrically conductive layer deposited on the upper surface of the plurality of mirror plates, an internal surface of the plurality of standoff regions, and a portion of the bias electrode array to electrically couple the plurality of mirror plates to the bias electrode array.
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Accused Products
Abstract
A method of fabricating an electrical connection for a spatial light modulator includes providing a first substrate including a plurality of bias electrodes and a plurality of dielectric bond pads. The method also includes providing a second substrate of a predetermined thickness, the second substrate including a plurality of recessed regions within the predetermined thickness and arranged in a spatial manner as a second array, each of the recessed regions being bordered by a standoff region, and joining the dielectric bond pads of the first substrate to the standoff region of the second substrate. The method further includes forming mirror structures from a first portion of the second substrate, exposing a portion of the upper surface of the plurality of bias electrodes, and depositing a conductive layer on the mirror structures and the exposed portion of the upper surface of the plurality of bias electrodes.
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Citations
10 Claims
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1. A spatial light modulator adapted to reflect incident light, the spatial light modulator comprising:
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a first substrate comprising a bias grid; a bias electrode array coupled to the first substrate and electrically coupled to the bias grid; a dielectric bond pad array coupled to the bias electrode array; a standoff region array coupled to the dielectric bond pad array, the standoff region array comprising a plurality of standoff regions; a plurality of mirror plates having an upper surface, the plurality of mirror plates flexibly coupled to the standoff region array; and an electrically conductive layer deposited on the upper surface of the plurality of mirror plates, an internal surface of the plurality of standoff regions, and a portion of the bias electrode array to electrically couple the plurality of mirror plates to the bias electrode array. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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Specification