Thermal interface adapter plate conversion kit and method

• US 7,200,011 B2
• Filed: 05/02/2003
• Issued: 04/03/2007
• Est. Priority Date: 05/02/2003
• Status: Expired due to Fees

• Current Assignee: Astec International Limited (Emerson Electric Company)
• Original Assignee: Astec International Limited (Emerson Electric Company)
• Inventors: Fronk, Karl T.
• Primary Examiner(s): Dinh; Tuan
• Assistant Examiner(s): Bui; Hung S.
• Application Number:
  US10/428,974
• Publication Number:
  US 20040218375A1
• Time in Patent Office: 1,432 Days
• Field of Search: 361/801, 361/719, 361/760, 361/720, 361/810, 361/718, 363/144
• US Class Current: 361/810
• CPC Class Codes: H05K 7/209 Heat transfer by conduction from internal heat source to heat radiating structure H05K7/20909 takes precedence

Abstract

A method of selectively assembling a printed circuit board (PCB) module intended for attachment to another structure, such as another larger PCB. A plurality of different mounting hardware for a PCB are provided for enabling the selective enhancement of the thermal characteristics of the module. One embodiment provides a conversion kit comprising a PCB having a circuit mounted thereon, lead frames, a baseplate, and open frame and baseplate mounting hardware that, when selectively attached to the PCB, result in an open frame or a baseplate module. The manufacturer of power conversion or other modules can thus manufacture and pretest the board'"'"'s electronics before assembly into either an open frame or baseplate module, while also providing a conversion kit that includes inexpensive mounting hardware to enable a user to select between assembling a module as either an open frame or a baseplate module.

Claims

1. A method of selectively assembling a module as either an open frame module or a baseplate module from a conversion kit including a printed circuit board (PCB) having an electric circuit thereon and a first surface and an opposite surface and having at least one row of pins extending out from said first surface proximate to an edge of said PCB for enabling said circuit to be connected to a circuit external to said PCB;

at least one non-conductive lead frame having a plurality of holes in a position to enable said lead frame to be positioned on the first surface of said PCB with each said pin extending through a corresponding hole in said lead frame;

open frame mounting hardware;

baseplate mounting hardware; and

a baseplate, said method comprising;

selecting said PCB;

selecting mounting hardware according to what type of module is desired, wherein said open frame mounting hardware is for assembling said open frame module and said baseplate mounting hardware is for assembling said baseplate module;

attaching said at least one lead frame to said selected PCB using said selected mounting hardware; and

attaching said baseplate to said opposite surface of said selected PCB if said desired type of module is said baseplate module.

2. The method of claim 1, wherein said PCB circuit is a power converter.

3. The method of claim 1, wherein said mounting hardware for said open frame module includes said at least one lead frame including snap fit fasteners, and wherein said PCB includes holes formed in said first surface thereof, for enabling the fasteners on said lead frame to be snap fit in said holes such that said lead frame is fastened onto said first surface of said PCB.

4. The method of claim 1, wherein said PCB includes a plurality of holes formed therein, and wherein said mounting hardware for said baseplate module includes said baseplate having a plurality of posts extending out from the surface thereof, sized and positioned to fit through said PCB holes, and a plurality of fasteners;

wherein said posts, said corresponding holes in said PCB, said at least one lead frame and said holes formed therein are all sized such that at least some of said posts are also enabled to extend through said holes in said at least one lead frame, such that, when assembled using said fasteners, said PCB and said at least one lead frame are clamped in place between said baseplate and said fasteners.

5. The method of claim 1, wherein said baseplate includes a plurality of pre-tapped holes;

and wherein said PCB and said at least one lead frame define additional holes that enable said fasteners to extend therethrough during assembly and mate with said pre-tapped holes to provide said clamping.

6. A conversion kit for enabling a user to select between assembling a module as either an open frame module or a baseplate module, said kit comprising:

a printed circuit board (PCB) including an electrical circuit having one or more components mounted on a first surface thereof and having two rows of pins extending out from said first surface proximate to opposite edges of said PCB for enabling said circuit to be connected to a circuit external to said PCB, and including one or more components of said circuit mounted on the opposite surface of said PCB;

two non-conductive lead frames each having a plurality of holes in a position to enable each lead frame to be positioned on the surface of said PCB with each said pin extending through a corresponding hole in one of said lead frames; and

providing

a) open frame mounting hardware for attaching said lead frames to said PCB, and

b) baseplate mounting hardware for attaching a baseplate to said opposite surface of said PCB and for attaching said lead frames to the PCB;

wherein said open frame mounting hardware, said baseplate, and said baseplate mounting hardware are provided for enabling user selection for assembling either said open frame module or said baseplate module so as to provide user-selectable heat dissipation alternatives for said circuit components and for attaching said lead frames to said PCB.

7. The kit of claim 6, wherein said PCB includes holes formed at each corner thereof, and wherein said open frame mounting hardware comprises means for enabling said lead frames to be snap fit in holes formed in the surface of said PCB.

8. The kit of claim 6, wherein said PCB includes holes formed at each corner thereof;

wherein said baseplate mounting hardware comprises posts positioned at each corner of said baseplate and sized for fitting through said PCB holes and a plurality of fasteners; and

wherein said lead frames include holes formed in each end thereof; and

wherein said posts, said corresponding holes in said PCB, said lead frames and said holes formed in each end of said lead frames are all sized such that two of said posts are also enabled to extend through each said lead frame, and such that, when assembled using said fasteners, said PCB and said lead frames are clamped in place between said baseplate and said fasteners.

9. The kit of claim 8, wherein said baseplate includes a plurality of pre-tapped holes;

and wherein said PCB and said lead frames include additional holes formed therein to enable said fasteners to extend through said holes during assembly and mate with said pre-tapped holes to provide said clamping.

10. The kit of claim 8, wherein said posts are sized such that, when said baseplate is mounted on said PCB, said posts provide a predetermined amount of spacing between said first surface of said PCB and the surface of a structure on which the assembled PCB is to be installed.

11. The kit of claim 10, wherein said posts are pre-tapped to enable fasteners to secure said PCB to the surface of said structure.

12. The kit of claim 6, wherein said lead frames are sized such that, when said lead frames are mounted on said PCB, said lead frames provide a predetermined amount of spacing between said first surface of said PCB and the surface of a structure on which the assembled PCB is to be installed.

13. The kit of claim 12, wherein said lead frames include pre-tapped holes to enable fasteners to secure said PCB to the surface of a structure on which the assembled PCB is to be installed.

14. The kit of claim 6, wherein said PCB circuit is a power converter, and wherein said one or more components on the opposite side of said PCB comprise power components.