High-temperature reduced size manometer
First Claim
Patent Images
1. A pressure transducer, comprising:
- a. a pressure sensor configured to operate above a first temperature;
b. one or more electronic components electrically coupled to the pressure sensor, the one or more electronic components being configured to operate below a second temperature, the first temperature being greater than the second temperature; and
c. a solid-state heat pump disposed between the pressure sensor and the one or more electronic components, the solid-state heat pump being configured to transfer heat from the one or more electronic components to the pressure sensor when the one or more electronic components are operating below the second temperature and the pressure sensor is operating above the first temperature.
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Abstract
A pressure-sensing device and method for making and using such device having a temperature differential between two portions of the device is disclosed. A solid-state heat pump, such as a thermo-electric cooler (TEC), is used to pump heat from a cold portion to a hot portion of the device. A pressure sensor sensing the pressure of a hot fluid is disposed in the hot portion of the device, and sensor electronics are disposed in the cold portion of the device.
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Citations
29 Claims
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1. A pressure transducer, comprising:
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a. a pressure sensor configured to operate above a first temperature; b. one or more electronic components electrically coupled to the pressure sensor, the one or more electronic components being configured to operate below a second temperature, the first temperature being greater than the second temperature; and c. a solid-state heat pump disposed between the pressure sensor and the one or more electronic components, the solid-state heat pump being configured to transfer heat from the one or more electronic components to the pressure sensor when the one or more electronic components are operating below the second temperature and the pressure sensor is operating above the first temperature. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A pressure-sensing device, comprising:
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a. a housing; b. sensor electronics disposed within a first portion of the housing; c. a pressure sensor disposed within a second portion of the housing; and d. a solid-state heat pump disposed between the first and second portions of the housing, the solid state heat pump configured to transfer heat from a first face of the solid state heat pump, proximal to the first portion of the housing, to a second face of the solid state heat pump, proximal to the second portion of the housing. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A pressure-sensing device, comprising:
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a. a housing; b. a thermal channel substantially dividing the housing into a first portion and a second portion; c. sensor electronics disposed within the first portion of the housing; d. a capacitive pressure sensor disposed within the second portion of the housing; and e. a thermo-electric cooler configured to transfer heat from a first face of the thermo-electric cooler, proximal to the first portion of the housing, to a second face of the thermo-electric cooler, proximal to the second portion of the housing. - View Dependent Claims (20, 21, 22, 23, 24, 25)
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26. A pressure transducer, comprising:
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a capacitive pressure sensor, the sensor defining an interior chamber and a flexible diaphragm, the diaphragm dividing the interior chamber into a first portion and a second portion, the second portion being evacuated to a vacuum reference pressure, the diaphragm flexing in a first direction when a pressure in the first portion is greater than the vacuum reference pressure, the diaphragm flexing in a second direction when the pressure in the first portion is less than the vacuum reference pressure, the sensor further including a conductive element disposed in the second portion, at least a portion of the diaphragm being conductive, a capacitance of the conductive element and the conductive portion of the diaphragm being representative of a pressure in the first portion; a thermally conductive heater shell, the capacitive pressure sensor being disposed within the heater shell; an external enclosure, the heater shell being disposed within the external enclosure; one or more electronic components electrically coupled to the pressure sensor, the one or more electronic components generating an output signal representative of the pressure within the first portion of the interior chamber, the one or more electronic components being disposed within the external enclosure and outside the heater shell; and a solid state heat pump disposed between the one or more electronic components and the pressure sensor, the heat pump being configured to transfer heat from the one or more electronic components to the pressure sensor. - View Dependent Claims (27, 28, 29)
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Specification