Contoured CMP pad dresser and associated methods
First Claim
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1. A method of increasing work load on centrally located superabrasive particles in a CMP pad dresser during dressing of a CMP pad with the dresser comprising:
- configuring the superabrasive particles in a pattern that reduces penetration of peripherally located particles into the CMP pad and increases penetration of centrally located particles into the CMP pad.
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Abstract
CMP pad dressers with increased pad dressing work loads on the centrally located abrasive particles during dressing of a CMP pad, and methods associated therewith are disclosed and described. The increase in work load on centralized particles improves pad dressing performance and also extends the service life of the pad dresser.
134 Citations
62 Claims
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1. A method of increasing work load on centrally located superabrasive particles in a CMP pad dresser during dressing of a CMP pad with the dresser comprising:
configuring the superabrasive particles in a pattern that reduces penetration of peripherally located particles into the CMP pad and increases penetration of centrally located particles into the CMP pad. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31)
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32. A CMP pad dresser comprising:
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a substrate; and a plurality of superabrasive particles attached to the substrate, wherein said superabrasive particles are configured in a predetermined pattern that provides an upward slope from working ends of the peripherally located particles to working ends of the centrally located particles. - View Dependent Claims (35, 36, 37, 38, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57, 58, 59, 60, 61, 62)
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33. A CMP pad dresser comprising:
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a substrate; and a plurality of superabrasive particles attached to the substrate, wherein said superabrasive particles are configured in a predetermined pattern that provides a density of peripherally located particles that is higher than a density of centrally located particles. - View Dependent Claims (39, 40, 41, 42, 43)
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34. A CMP pad dresser comprising:
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a substrate; and a plurality of superabrasive particles attached to the substrate, wherein said superabrasive particles are configured in a predetermined pattern that provides centrally located particles with an attitude that causes higher particle penetration into the CMP pad than penetration provided by an attitude of the peripherally located particles. - View Dependent Claims (44, 45, 46)
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Specification