Method of manufacturing a cloverleaf microgyroscope and cloverleaf microgyroscope
First Claim
1. A method of manufacturing a cloverleaf microgyroscope containing an integrated post comprising:
- a) attaching a post wafer to a resonator wafer,b) forming a bottom post from the post wafer being attached to the resonator wafer,c) attaching the resonator wafer to a base wafer, wherein the bottom post fits into a post hole in the base wafer,d) forming a top post from the resonator wafer, wherein the bottom and top post are formed symmetrically around the same axis, ande) attaching a cap wafer on top of the base wafer.
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Accused Products
Abstract
The present invention relates to a method of manufacturing a cloverleaf microgyroscope containing an integrated post comprising: attaching a post wafer to a resonator wafer, forming a bottom post from the post wafer being attached to the resonator wafer, attaching the resonator wafer to a base wafer, wherein the bottom post fits into a post hole in the base wafer, forming a top post from the resonator wafer, wherein the bottom and top post are formed symmetrically around the same axis, and attaching a cap wafer on top of the base wafer. The present invention relates further to a gyroscope containing an integrated post with on or off-chip electronics.
34 Citations
37 Claims
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1. A method of manufacturing a cloverleaf microgyroscope containing an integrated post comprising:
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a) attaching a post wafer to a resonator wafer, b) forming a bottom post from the post wafer being attached to the resonator wafer, c) attaching the resonator wafer to a base wafer, wherein the bottom post fits into a post hole in the base wafer, d) forming a top post from the resonator wafer, wherein the bottom and top post are formed symmetrically around the same axis, and e) attaching a cap wafer on top of the base wafer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. A method of manufacturing a cloverleaf micro gyroscope containing an integrated post comprising:
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a) attaching a post wafer to a resonator wafer, b) forming a bottom post from the post wafer being attached to the resonator wafer, c) application specific integrated circuits (ASIC) electronic on a base wafer, d) attaching the resonator wafer to the base wafer, wherein the bottom post fits into a post hole in the base wafer, e) forming a top post from the resonator wafer, wherein the bottom and top post are formed symmetrically around the same axis, and f) attaching a cap wafer on top of the base wafer. - View Dependent Claims (20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37)
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Specification