MEMS package using flexible substrates, and method thereof
First Claim
Patent Images
1. A MEMS package comprising:
- at least one MEMS device located on a flexible substrate; and
a metal structure surrounding said at least one MEMS device wherein a bottom surface of said metal structure is attached to said flexible substrate and wherein said flexible substrate is folded over a top surface of said metal structure and attached to said top surface of said metal structure thereby forming said MEMS package.
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Abstract
A MEMS package and a method for its forming are described. The MEMS package has at least one MEMS device located on a flexible substrate. A metal structure surrounds the at least one MEMS device wherein a bottom surface of the metal structure is attached to the flexible substrate and wherein a portion of the flexible substrate is folded over a top surface of the metal structure and attached to the top surface of the metal structure thereby forming the MEMS package.
140 Citations
31 Claims
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1. A MEMS package comprising:
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at least one MEMS device located on a flexible substrate; and a metal structure surrounding said at least one MEMS device wherein a bottom surface of said metal structure is attached to said flexible substrate and wherein said flexible substrate is folded over a top surface of said metal structure and attached to said top surface of said metal structure thereby forming said MEMS package. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A method for fabricating a MEMS package comprising:
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mounting at least one MEMS device onto a flexible substrate; attaching a bottom surface of a metal structure to said flexible substrate surrounding said at least one MEMS device; and folding said flexible substrate over a top surface of said metal structure and attaching said flexible substrate to said top surface of said metal structure thereby forming said MEMS package. - View Dependent Claims (19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31)
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Specification