Co-packaged control circuit, transistor and inverted diode
First Claim
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1. A semiconductor package, comprising:
- an electrically conductive pad having a top surface and a bottom surface;
a first diode having a first anode and a first cathode opposite of the first anode, the first cathode being mounted and electrically connected to the top surface of the conductive pad;
a second diode having a second cathode and a second anode opposite of the second cathode, the second anode being mounted and electrically connected to the top surface of the conductive pad, whereby the first diode and the second diode are electrically connected in series through the conductive pad;
a first lead electrically connected to the first anode;
a second lead electrically connected to the second cathode;
another conductive pad;
an insulating body sandwiched between the electrically conductive pad and the another conductive pad; and
a MOS-gated switch disposed on the another conductive pad and electrically connected to at least one of the diodes.
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Abstract
A copackaged electronic device comprises a diode device having an anode coupled to a drain electrode of a switching device and a cathode capable of being coupled to an external circuit. The switching device may be controlled by an integrated circuit mounted on a source electrode of the switching device and electrically connected such that the integrated circuit is capable of controlling switching of the switching device. For example, the device is used in a power factor correction circuit. The diode device comprises at least one inverted diode having a solderable anode and a wire-bondable cathode.
9 Citations
11 Claims
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1. A semiconductor package, comprising:
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an electrically conductive pad having a top surface and a bottom surface; a first diode having a first anode and a first cathode opposite of the first anode, the first cathode being mounted and electrically connected to the top surface of the conductive pad; a second diode having a second cathode and a second anode opposite of the second cathode, the second anode being mounted and electrically connected to the top surface of the conductive pad, whereby the first diode and the second diode are electrically connected in series through the conductive pad; a first lead electrically connected to the first anode; a second lead electrically connected to the second cathode; another conductive pad; an insulating body sandwiched between the electrically conductive pad and the another conductive pad; and a MOS-gated switch disposed on the another conductive pad and electrically connected to at least one of the diodes. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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Specification