Wafer bonding of micro-electro mechanical systems to active circuitry
First Claim
Patent Images
1. A single integrated wafer package comprising:
- a micro electromechanical system (MEMS) wafer with a first surface, the MEMS wafer having at least one MEMS component on its first surface;
an active device wafer with a first surface, the active device wafer having an active device circuit on its first surface and configured to be spaced apart from the MEMS wafer such that the first surface of the MEMS wafer faces the first surface of the active device wafer;
a seal ring adjacent the first surface of the MEMS wafer such that a seal is formed about the MEMS component by at least the combination of the seal ring and the first surface of the MEMS wafer; and
an external contact to the single integrated wafer package, wherein the external contact accessible externally to the single integrated wafer package and is electrically coupled to the active device circuit of the active device wafer.
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Abstract
A single integrated wafer package includes a micro electromechanical system (MEMS) wafer, an active device wafer, and a seal ring. The MEMS wafer has a first surface and includes at least one MEMS component on its first surface. The active device wafer has a first surface and includes an active device circuit on its first surface. The seal ring is adjacent the first surface of the MEMS wafer such that a seal is formed about the MEMS component. An external contact is provided on the wafer package. The external contact is accessible externally to the wafer package and is electrically coupled to the active device circuit of the active device wafer.
94 Citations
14 Claims
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1. A single integrated wafer package comprising:
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a micro electromechanical system (MEMS) wafer with a first surface, the MEMS wafer having at least one MEMS component on its first surface; an active device wafer with a first surface, the active device wafer having an active device circuit on its first surface and configured to be spaced apart from the MEMS wafer such that the first surface of the MEMS wafer faces the first surface of the active device wafer; a seal ring adjacent the first surface of the MEMS wafer such that a seal is formed about the MEMS component by at least the combination of the seal ring and the first surface of the MEMS wafer; and an external contact to the single integrated wafer package, wherein the external contact accessible externally to the single integrated wafer package and is electrically coupled to the active device circuit of the active device wafer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A single integrated wafer package comprising:
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a micro electromechanical system (MEMS) wafer with a first surface, the MEMS wafer having at least one MEMS component on its first surface; an active device wafer with a first surface, the active device wafer having an active device circuit on its fist surface; a seal ring adjacent the first surface of the MEMS wafer such that a seal is formed about the MEMS component; an external contact to the single integrated wafer package, wherein the external contact accessible externally to the single integrated wafer package and is electrically coupled to the active device circuit of the active device wafer; and a microcap wafer coupled between the MEMS wafer and the active device wafer, and wherein the seal ring is sandwiched between the MEMS wafer and the microcap wafer thereby providing the seal about the MEMS component. - View Dependent Claims (12, 13, 14)
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Specification