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Temperature compensation for silicon MEMS resonator

  • US 7,202,761 B2
  • Filed: 04/18/2006
  • Issued: 04/10/2007
  • Est. Priority Date: 04/16/2003
  • Status: Active Grant
First Claim
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1. A microelectromechanical resonator, comprising:

  • a substrate;

    an oscillating beam formed from a plurality of materials, wherein the oscillating beam includes;

    (i) an inner-core comprising a first material having a first coefficient of thermal expansion, and(ii) an outer-layer, surrounding the inner-core, comprising a second material having a second coefficient of thermal expansion, wherein the second thermal expansion coefficient is different from the first thermal expansion coefficient; and

    an anchor, disposed on the substrate and coupled to the oscillating beam, to, at least in part, support the oscillating beam above the substrate.

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