Automatic optical inspection system and method

• US 7,203,355 B2
• Filed: 12/24/2002
• Issued: 04/10/2007
• Est. Priority Date: 12/24/2002
• Status: Expired due to Fees

• Current Assignee: Orbotech Limited (KLA Corporation)
• Original Assignee: Orbotech Limited (KLA Corporation)
• Inventors: Levi, Michael, Fridman, Elad, Solomon, Bernard, Aspir, Doron
• Primary Examiner(s): COUSO, YON JUNG
• Application Number:
  US10/327,115
• Publication Number:
  US 20040120570A1
• Time in Patent Office: 1,568 Days
• Field of Search: 382/147, 382/148, 382/149, 382/145, 382/150, 382/151, 382/152, 348/126, 348/125, 356/237.5, 356/237.4
• US Class Current: 382/145
• CPC Class Codes: G01N 21/95607 using a comparative method
• CPC Class Codes: G06T 7/0004 Industrial image inspection

Abstract

A system comprising automatic apparatus for automatic optical inspection (AOI), verification and correction of defects in an article, and a processor operative to select between AOI, verification and correction for performing on the article.

Claims

1. A system comprising:

a chassis defining locations for performing thereon automatic optical inspection (AOI) to identify possible defects on a printed circuit board being processed, verification of said possible defects and correction of defects on said printed circuit board without removing said printed circuit board from said chassis; and

a controller operative to select between AOI, verification and correction for performing on said printed circuit board.

2. The system according to claim 1, wherein said chassis comprises a first location comprising an AOI device and a second location comprising a device operative to perform at least one of verification and correction of defects in the article.

3. The system according to claim 2, further comprising a conveyor for conveying an article between said first and second stations.

4. The system according to claim 1, wherein said integrated AOI, verification and correction apparatus is operative to perform AOI on a first article and generally simultaneously perform one of verification and correction on a second article.

5. The system according to claim 4, wherein a time interval for performing an operation to verify and to correct suspected defects on a first article is constrained by a time required to perform AOI on a second article.

6. The system according to claim 5, wherein articles removed from said chassis that include a non-verified suspected defect are provided to a stand alone verification and correction station, and wherein said verification and correction station is operative to provide a verification and correction functionality with respect to said non-verified suspected defect.

7. The system according to claim 5, wherein articles removed from said chassis that include a non-corrected suspected defect are provided to a stand alone verification and correction station, and wherein said verification and correction station is operative to provide a verification and correction functionality with respect to said non-corrected suspected defect.

8. A method for manufacture of printed circuit boards comprising:

forming a portion of an electrical circuit on a substrate;

providing a processing apparatus chassis for processing said substrate, said chassis defining locations for performing thereon functionalities of automatic optical inspection (AOI) to identify possible defects in said portion of an electrical circuit formed on said substrate, verification of said possible defects and correction of defects in said portion of an electrical circuit formed on said substrate without removing said substrate from said chassis; and

selecting between AOI, verification and correction functionalities for performing on the substrate.

9. The method according to claim 8, further comprising performing AOI on the substrate at an inspection location on said chassis, and verifying any suspected defects found during AOI while said substrate is on said chassis.

10. The method according to claim 9, further comprising correcting any defects that have been found during AOI and verification, white said substrate is on said chassis.

11. The method according to claim 9, further comprising correcting any real defects that have been verified, while said substrate is on said chassis.

12. The method according to claim 8, further comprising performing at an inspection location on said chassis AOI on the substrate, and correcting at a correction location any defects found during AOI.

13. The method according to claim 8, further comprising performing another manufacturing step after performing at least AOI and correction on the substrate.

14. The method according to claim 8, further comprising performing, on said integrated automatic apparatusa AOI on a first substrate and generally simultaneously performing, on said integrated automatic apparatus, at least one of verification and correction on a second substrate.

15. An integrated inspection, defect verification and correction system for electrical circuits comprising:

an electrical circuit processing apparatus chassis defining thereon an inspection location and a defect verification and correction location separated from said inspection location; and

an electrical circuit positioner operative to automatically position an electrical circuit to be processed initially at said inspection location on said chassis and thereafter to automatically position said electrical circuit at said defect verification and correction location on said chassis.

16. An integrated inspection, defect verification and correction system for electrical circuits according to claim 15, further comprising an optical inspection assembly located at said inspection location and a video camera located at said defect verification and correction location.

17. An integrated inspection, defect verification and correction system for electrical circuits according to claim 16 and wherein said video camera comprises a video microscope.

18. An integrated inspection, defect verification and correction system for electrical circuits according to claim 17, wherein said video microscope is spaced from an electrical circuit located at said defect verification and correction location by a distance which enables physical access to said electrical circuit for correction thereof.

19. An integrated inspection, defect verification and correction system for electrical circuits according to claim 15, wherein said electrical circuit positioner comprises at least first and second electrical circuit supports, said electrical circuit positioner being operative to position said first electrical circuit support at said inspection location while said second electrical circuit support is positioned at said defect verification and correction location and thereafter to position said second electrical circuit support at said inspection location while said first electrical circuit support is positioned at said defect verification and correction location.

20. An integrated inspection, defect verification and correction system for electrical circuits according to claim 16, wherein said optical inspection assembly is static and is operative to inspect an electrical circuit as said electrical circuit is translated relative thereto and said video camera is movable and operable to verify an electrical circuit as said electrical circuit is static at said defect verification and correction location.

21. An integrated inspection and defect verification system for electrical circuits comprising:

a chassis defining an inspection location and a defect verification location;

an electrical circuit positioner operative automatically to position an electrical circuit initially at said inspection location and thereafter at said defect verification location; and

an optical inspection assembly located at said inspection location and a defect verification assembly located at said defect verification location; and

an operational mode selector operative to enable operation of said optical inspection assembly and said defect verification assembly to be selectably coordinated in time in at least two different modes of operation including;

a first mode wherein the required time of operation of the optical inspection assembly governs the maximum duration of operation of the defect verification assembly; and

a second mode wherein the required time of operation of the defect verification assembly governs the maximum duration of operation of the defect verification assembly.