Manufacturing method of acoustic sensor

• US 7,204,009 B2
• Filed: 07/21/2005
• Issued: 04/17/2007
• Est. Priority Date: 09/03/1997
• Status: Expired due to Fees

• Current Assignee: Hosiden Electronics Co. Ltd. (Hosiden Corporation)
• Original Assignee: Hosiden Electronics Co. Ltd. (Hosiden Corporation)
• Inventors: Ohbayashi, Yoshiaki, Yasuda, Mamoru, Kawamura, Takao
• Primary Examiner(s): Kim; Paul D
• Application Number:
  US11/185,775
• Publication Number:
  US 20050251995A1
• Time in Patent Office: 635 Days
• Field of Search: 294/17, 295/921, 295/94, 296/091, 181/171, 181/172, 216/65, 156/89.11, 156/89.12, 381173-175, 381/396, 381/398, 367/170, 367/171, 367/181, 367/140, 367/141
• US Class Current: 29/594
• CPC Class Codes: H04R 19/005 using semiconductor materials
• CPC Class Codes: H04R 19/016 for microphones
• CPC Class Codes: H04R 31/00 Apparatus or processes specially adapted for the manufacture of transducers or diaphragms therefor manufacture of microstructural arrangements of deformable or non-deformable structures in general B81C1/00182
• CPC Class Codes: H04R 31/006 Interconnection of transducer parts of diaphragm and outer suspension by moulding H04R31/003
• CPC Class Codes: Y10T 29/49002 Electrical device making
• CPC Class Codes: Y10T 29/49005 Acoustic transducer
• CPC Class Codes: Y10T 29/4908 Acoustic transducer
• CPC Class Codes: Y10T 29/49798 Dividing sequentially from leading end, e.g., by cutting or breaking

Abstract

The present invention relates to a semiconductor electret condenser microphone capable of being reduced in size and including an acoustic sensor 100 and a case 200 for accommodating the acoustic sensor 100, the acoustic sensor 100 has a semiconductor chip 110 forming necessary electronic circuits 111A to 111C, and opening a through hole 112 away from the electronic circuits 111A to 111C, an electrode layer 120 formed on the surface of the semiconductor chip 110 away from the through hole 112, an electret member 130 laminated away from part of the electrode layer 120 and through hole 112, and a diaphragm 140 provided with a spacing 160 to the electret member 130, in which the electrode layer 120 exposed from the electret member 130 is connected to the electrode 111a of the electronic circuit 111A through the case 200 (FIG. 6).

Claims

1. A manufacturing method of acoustic sensor comprising in the following order a step of forming a necessary electronic circuit on a wafer, a step of forming an electrode layer on the wafer surface, a step of laminating an electret layer on said electrode layer, a step of laminating a spacer on said electret layer, a step of adhering a diaphragm on the spacer, and then a step of dividing said wafer into individual acoustic sensors.