Hermetically sealed microdevice with getter shield
First Claim
1. A method of making a hermetically sealed microdevice, the method comprising the steps of:
- providing a substrate with a recess therein;
providing a cap with a recess therein;
defining a microstructure and a vent channel in a silicon layer, the vent channel configured to couple to the recesses after the bonding step;
forming a vent, the vent configured to couple to the vent channel after the bonding step;
disposing a getter layer in at least one of the recesses;
bonding the cap, silicon wafer, and substrate together such that the recesses in the cap and substrate form a cavity to enclose the microstructure, and wherein the vent, vent channel and cavity are coupled together;
evacuating the cavity through the vent and vent channel; and
sealing the vent to provide a hermetically sealed cavity enclosing the microstructure.
2 Assignments
0 Petitions
Accused Products
Abstract
A microdevice that comprises a device microstructure (38) and vent channel (34) in a wafer (14) that is sandwiched between a substrate (10) and a cap (16). The cap (16) and substrate (10) have recesses (41, 21) around the microstructure (22) to define a cavity. A vent (25) is connected to the vent channel (34) and subsequently to the cavity. The vent (25) is used to evacuate and seal the microstructure (38) in the cavity. A getter layer (32) can be used to maintain the cavity vacuum. An electrical connection can be provided through the vent (25), vent channel (34) and cavity to the getter (32) to electrically ground the getter layer (32).
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Citations
14 Claims
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1. A method of making a hermetically sealed microdevice, the method comprising the steps of:
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providing a substrate with a recess therein; providing a cap with a recess therein; defining a microstructure and a vent channel in a silicon layer, the vent channel configured to couple to the recesses after the bonding step; forming a vent, the vent configured to couple to the vent channel after the bonding step; disposing a getter layer in at least one of the recesses; bonding the cap, silicon wafer, and substrate together such that the recesses in the cap and substrate form a cavity to enclose the microstructure, and wherein the vent, vent channel and cavity are coupled together; evacuating the cavity through the vent and vent channel; and sealing the vent to provide a hermetically sealed cavity enclosing the microstructure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method of making a hermetically sealed microdevice, the method comprising the steps of:
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providing a substrate with a recess therein; providing a cap with a recess therein; defining a microstructure and a vent channel in a silicon wafer, the vent channel configured to couple to the recesses after the bonding step; forming a vent the vent configured to couple to the vent channel after the bonding step; disposing metal interconnects; mounting the silicon wafer to the substrate; disposing a composite thin metal film getter in the recess of the cap and providing for a ground connection thereto; anodic bonding the cap to the silicon wafer such that the recess in the cap forms a cavity to enclose the microstructure and the vent is aligned with the vent channel, and the vent, vent channel and cavity are coupled together; evacuating the cavity through the vent and vent channel; and sealing the vent with solder to provide a hermetically sealed cavity enclosing the microstructure and to provide an external electrical ground connection to the getter layer. - View Dependent Claims (11, 12, 13, 14)
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Specification