Wafer holding, wafer support member, wafer boat and heat treatment furnace

• US 7,204,887 B2
• Filed: 10/16/2001
• Issued: 04/17/2007
• Est. Priority Date: 10/16/2000
• Status: Expired due to Term

• Current Assignee: Nippon Steel Corporation
• Original Assignee: Nippon Steel Corporation
• Inventors: Tanaka, Koki, Inoue, Yoshiharu, Hayashi, Shunichi, Sasaki, Tsutomu, Kawamura, Keisuke, Ikari, Atsushi, Matsumura, Atsuki, Hamaguchi, Isao
• Primary Examiner(s): Kackar; Ram N.
• Application Number:
  US10/149,939
• Publication Number:
  US 20030029570A1
• Time in Patent Office: 2,009 Days
• Field of Search: 118/725, 118/728, 118/724, 432/5, 432/152, 432/241, 432/253, 432/258, 432/259, 219/444.1, 219/544, 206/832, 392/416, 392/418
• US Class Current: 118/725
• CPC Class Codes: H01L 21/67309 characterized by the substrate support
• CPC Class Codes: H01L 21/68735 characterised by edge profile or support profile
• CPC Class Codes: H01L 21/6875 characterised by a plurality of individual support members, e.g. support posts or protrusions
• CPC Class Codes: Y10S 206/832 Semiconductor wafer boat

Abstract

The present invention provides a wafer holder, a wafer support member, a wafer boat and a heat treatment furnace, which are capable of sufficiently suppressing slip dislocations, without lowering productivity and at low cost, in the high temperature heat treatment of silicon wafers, and said wafer holder is characterized in that: the wafer holder is composed of a wafer support plate and three or more wafer support members mounted on said wafer support plate, each of the wafer support members having a wafer support portion or more; at least one of said wafer support members is a tilting wafer support member which has a plurality of upward-convex wafer support portions on the upper surface and is tiltable with respect to said wafer support plate; and the wafer is supported by at least four wafer support portions.

Claims

1. A wafer holder to hold a wafer on the upper surface characterized in that:

the wafer holder comprises a wafer support plate and three or more wafer support members mounted on said wafer support plate, wherein said wafer support members maintain rigidity and each having one or more wafer support portions;

wherein said wafer support members are fabricated from a material selected from the group consisting of SiC, Si₃N₄, Si and combinations thereof;

at least one of said wafer support members is a tilting wafer support member which has a plurality of upward-convex wafer support portions on the upper surface; and

is tiltable by a fulcrum located between said tilting wafer support member and the wafer support plate with respect to the wafer support plate; and

the wafer is supported by at least four wafer support portions by point contact;

including point contact by the upward-convex wafer support portions located on said upper surface of said tilting wafer support member.

2. A wafer holder according to claim 1, characterized in that the tilting wafer support member comprises:

a tabular member;

a fulcrum provided substantially at the center of the bottom surface of the tabular member and contacting with said wafer support plate at a point or along a line; and

upward-convex wafer support portions provided on the upper surface of the tabular member and on both sides of the fulcrum contacting with the wafer support plate.

3. A wafer holder according to claim 1, characterized in that the tilting wafer support member comprises:

a tabular member;

a fulcrum provided substantially at the center of the bottom surface of the tabular member and contacting with said wafer support plate at a point; and

three upward-convex wafer support portions provided on the upper surface of the tabular member.

5. A wafer holder according to any one of claims 1 to 4, characterized in that the material of the wafer support portions of the wafer support members is SiC and/or Si₃N₄.

6. A wafer holder according to any one of claims 1 to 4, characterized in that the wafer support plate of said wafer holder is a circular plate with a notch.

7. A wafer holder according to any one of claims 1 to 4, characterized in that the material of a tabular wafer support plate of said wafer holder is:

any one selected from SiC, Si₃N₄, Si, and Si coated SiC and/or Si_3N4 on the surface;

or a combination thereof.

8. A wafer boat to hold a plurality of wafers characterized by comprising:

at least two fixed members;

a plurality of support columns placed between the fixed members and substantially in parallel with each other;

a plurality of support grooves formed in the support columns; and

the wafer holders according to any one of claims 1 to 4, horizontally inserted in and held by the support grooves.

9. A heat treatment furnace for wafers characterized by being equipped with a wafer boat according to claim 8.

10. A wafer holder according to claim 1, wherein two upward-convex wafer support portions are located on the upper surface of said tilting wafer support member.

4. A wafer holder to hold a wafer on the upper surface characterized by comprising:

a wafer support plate;

three or more wafer support members placed on said wafer support plate, at least one of which is a first tilting wafer support member having a flat upper surface and a fulcrum provided substantially at the center of the bottom surface and contacting the wafer support plate at a point or along a line and being tiltable with respect to the wafer support plate; and

at least one second tilting wafer support member located above the flat upper surface of said first tilting wafer support member, said second tilting wafer support member having an upper surface and bottom surface, a fulcrum provided substantially at the center of the bottom surface of said second tilting wafer support member and contacting with said first tilting wafer support member on its flat upper surface at a point or along a line, and a plurality of upward-convex wafer support portions provided on the upper surface of said second tilting wafer support member, wherein each of said wafer support members maintains rigidity, wherein said wafer support members are fabricated from a material selected from the group consisting of SiC, Si₃N₄, Si and combinations thereof; and

the wafer is supported by at least four wafer support portions by point contact;

including point contact by the upward-convex wafer support portions located on said upper surface of said second tilting wafer support member.

11. A wafer holder according to claim 4, wherein two upward-convex wafer support portions are located on the upper surface of said second tilting wafer support member.