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Electronic device and chip package

  • US 7,205,646 B2
  • Filed: 04/22/2003
  • Issued: 04/17/2007
  • Est. Priority Date: 05/19/2000
  • Status: Expired due to Term
First Claim
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1. A chip package comprising:

  • a first chip;

    a second chip;

    a circuitry component;

    a solder ball under a bottom surface of said circuitry component;

    a solder bump under said first chip, wherein said solder bump connects said first chip and a top surface of said circuitry component; and

    more than three gold bumps aligned in a line and connecting said first and second chips.

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