Off-axis levelling in lithographic projection apparatus

• US 7,206,058 B2
• Filed: 01/04/2006
• Issued: 04/17/2007
• Est. Priority Date: 03/08/1999
• Status: Expired due to Fees

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: Modderman, Theodorus Marinus, Nijmeijer, Gerrit Johannes, Jasper, Johannes Christiaan Maria
• Primary Examiner(s): Kim; Peter B.
• Application Number:
  US11/324,754
• Publication Number:
  US 20060176459A1
• Time in Patent Office: 468 Days
• Field of Search: 355/55, 355/53, 355/67, 356/399, 356/400, 356/401, 310/12, 250/548, 430/30, 451/8
• US Class Current: 355/55
• CPC Class Codes: G03F 9/70 for microlithography measuring printed patterns for monitoring overlay G03F7/70633 or focus G03F7/70641; projection system adjustment G03F7/70258; position control G03F7/70775
• CPC Class Codes: G03F 9/7026 Focusing
• CPC Class Codes: G03F 9/7034 Leveling
• CPC Class Codes: G03F 9/7049 Technique, e.g. interferometric
• CPC Class Codes: G03F 9/7096 Arrangement, mounting, housing, environment, cleaning or maintenance of apparatus

Abstract

In an off-axis levelling procedure a height map of the substrate is generated at a measurement station. The height map is referenced to a physical reference surface of the substrate table. The physical reference surface may be a surface in which is inset a transmission image sensor. At the exposure station the height of the physical reference surface is measured and related to the focal plane of the projection lens. The height map can then be used to determine the optimum height and/or tilt of substrate table to position the exposure area on the substrate in best focus during exposure. The same principles can be applied to (reflective) masks.

Claims

1. A lithographic projection apparatus comprising:

a radiation system constructed and arranged to condition a beam of radiation including an EUV radiation;

a patterning device support constructed and arranged to support a patterning device, said patterning device being configured to pattern the beam of radiation including the EUV radiation to form a patterned beam of radiation;

a substrate support constructed and arranged to hold a substrate;

an exposure station having a projection system configured to project the patterned beam of radiation including the EUV radiation onto target portions of the substrate;

a sensor constructed and arranged to measure a position of each of a plurality of points on a surface of said patterning device in a first direction perpendicular to said surface so as to generate a height map of said surface of said patterning device; and

a controller configured to control a tilt of said patterning device support about at least one direction substantially perpendicular to said first direction based on said height map.

2. The apparatus of claim 1, wherein the patterning device is a reflective patterning device.

3. The apparatus of claim 1, wherein a wavelength of said EUV radiation is in a range from about 9 to 16 nm.

4. The apparatus of claim 1, wherein said projection system substantially includes reflective elements.

5. The apparatus of claim 1, further comprising a measurement station, said measurement station including a sensor that is configured to generate said height map.

6. The apparatus of claim 5, wherein said measurement station includes a first position detection system configured to measure a position of said patterning device support at said measurement station.

7. The apparatus of claim 6, wherein said exposure station includes a second position detection system configured to measure a position of said patterning device support at said exposure station.

8. The apparatus of claim 5, wherein said sensor at said measurement station is constructed and arranged to generate said height map relative to a physical reference surface arranged on said patterning device.

9. The apparatus of claim 5, wherein said tilt is adjusted by said controller to alleviate effects of an unflatness of said patterning device.

10. A device manufacturing method comprising:

conditioning a beam of radiation including an EUV radiation;

patterning the beam of radiation including the EUV radiation with a patterning device to form a patterned beam of radiation, said patterning device being supported by a patterning device support;

projecting the patterned beam of radiation including the EUV radiation with a projection system onto target portions of a substrate;

measuring a position of each of a plurality of points on a surface of said patterning device in a first direction perpendicular to said surface so as to generate a height map of said surface of said patterning device, and

controlling a tilt of said patterning device support about at least one direction substantially perpendicular to said first direction based on said height map.

11. The method of claim 10, wherein the patterning device is a reflective patterning device.

12. The method of claim 10, wherein a wavelength of said EUV radiation is in a range from about 9 to 16 nm.

13. The method of claim 10, wherein said projection system substantially includes reflective elements.

14. The method of claim 10, wherein said tilt is adjusted by said controller to alleviate effects of an unflatness of said patterning device.