Wafer-based planning methods and systems for batch-based processing tools
First Claim
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1. A computer-implemented wafer-based planning method for batch-based processing tools, comprising:
- providing planning data, comprising an operations level, a tool group set level, a tool group level, and a tool level, wherein the operations level comprises at least one operation and each operation corresponds to one tool group set in the tool group set level, one tool group in the tool group level, and one batch-based processing tool in the tool level; and
appending at least one tool group to the tool group level for each operation in the operations level, wherein the number of appended tool groups depends on the wafer capacity of the batch-based processing tool.
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Abstract
Computer-implemented wafer-based planning methods for batch-based processing tools. Tool groups are appended in a tool group level of planning data provided by a MES for converting planning data from batch-based to wafer-based data. The planning data with appended tool group is applied to dispatch processing tools.
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18 Claims
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1. A computer-implemented wafer-based planning method for batch-based processing tools, comprising:
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providing planning data, comprising an operations level, a tool group set level, a tool group level, and a tool level, wherein the operations level comprises at least one operation and each operation corresponds to one tool group set in the tool group set level, one tool group in the tool group level, and one batch-based processing tool in the tool level; and appending at least one tool group to the tool group level for each operation in the operations level, wherein the number of appended tool groups depends on the wafer capacity of the batch-based processing tool. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A wafer-based planning system for batch-based processing tools, comprising:
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a database providing planning data comprising an operations level, a tool group set level, a tool group level, and a tool level, wherein the operations level comprises at least one operation and each operation corresponds to one tool group set in the tool group set level, one tool group in the tool group level, and one batch-based processing tool in the tool level; and an appending module, coupled to the database, appending at least one tool group to the tool group level for each operation in the operations level, wherein the number of the appended tool groups depends on the wafer capacity of the batch-based processing tool. - View Dependent Claims (8, 9, 10, 11, 12)
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13. An integrated circuit product manufactured by a computer-implemented wafer-based planning method for batch-based processing tools, the method comprising:
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providing planning data, comprising an operations level, a tool group set level, a tool group level, and a tool level, wherein the operations level comprises at least one operation and each operation corresponds to one tool group set in the tool group set level, one tool group in the tool group level, and one batch-based processing tool in the tool level; and appending at least one tool group to the tool group level for each operation in the operations level, wherein the number of the appended tool groups depends on the wafer capacity of the batch-based processing tool. - View Dependent Claims (14, 15, 16, 17, 18)
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Specification