Sealing material tablet method of manufacturing the tablet and electronic component device
First Claim
1. A method of producing an encapsulating molding material tablet comprising:
- feeding an encapsulating molding material to a forming metal die, andcompressing the encapsulating molding material by upper and lower punches of the forming metal die,wherein a contact surface of at least one of the upper and lower punches, being the surface thereof closest to the encapsulating molding material, has thereon a release agent layer having a thickness greater than 0.001 μ
m and less than 0.07 μ
m.
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Accused Products
Abstract
To provide a method of producing an encapsulating molding material tablet by which adhesion of an encapsulating molding material to the punch surface of a tablet forming machine can be reduced, an encapsulating molding material tablet produced by this method, and an electronic part apparatus equipped with an element encapsulated using this encapsulating molding material tablet. A method of producing an encapsulating molding material tablet in which a release agent dissolved in a solvent is fed to the punch surface of a tablet forming machine to form a release agent layer having a thickness of over 0.001 μm and less than 0.07 μm on the above-mentioned punch surface, then, an encapsulating molding material is fed to the above-mentioned tablet forming machine for molding the material, an encapsulating molding material tablet produced by this method or having a contact angle ratio of 1.15 or more and less than 1.35, and an electron part apparatus equipped with an element encapsulated using this encapsulating molding material tablet.
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Citations
27 Claims
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1. A method of producing an encapsulating molding material tablet comprising:
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feeding an encapsulating molding material to a forming metal die, and compressing the encapsulating molding material by upper and lower punches of the forming metal die, wherein a contact surface of at least one of the upper and lower punches, being the surface thereof closest to the encapsulating molding material, has thereon a release agent layer having a thickness greater than 0.001 μ
m and less than 0.07 μ
m. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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- 23. An encapsulating molding thermosetting resin material tablet having a contact angle ratio of at least 1.15 and less than 1.35.
Specification