Method and system for analyzing defects of an integrated circuit wafer
First Claim
1. A method for analyzing defects of an integrated circuit wafer in the manufacture of the wafer, comprising:
- inspecting the wafer to automatically identify a plurality of defects;
classifying defects from the plurality of defects into a plurality of groups including a first and a second group, the first group including only defects having a reported size that is at least as small as a first predetermined size and the second group including only defects having a reported size that is at least as large as the first predetermined size;
selecting for further review, defects from the second and first groups respectively in a ratio of Ny;
Nx, where Ny/Nx is larger than the ratio of the number of defects in the second group to the number of defects in the first group.
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Abstract
Method and apparatus for efficiently analyzing visual defects of an integrated circuit wafer in the manufacturing process thereof by utilizing an asymmetric visual defect review methodology that can effectively extract high yield-killing defects out of numerous reported defects within the limited capacity and manpower available for review. Roughly described, the method comprises inspecting the semiconductor wafer, thereby obtaining the defect location and defect size, sampling the defects asymmetrically by determining asymmetrical defect review ratios, and thereby reviewing the defects asymmetrically. Also described is a method of asymmetrically sampling visual defects that can effectively extract out high yield-killing defects from a mass of defects by determining asymmetric defect review ratios, and a system for use in sampling visual defects asymmetrically.
5 Citations
20 Claims
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1. A method for analyzing defects of an integrated circuit wafer in the manufacture of the wafer, comprising:
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inspecting the wafer to automatically identify a plurality of defects; classifying defects from the plurality of defects into a plurality of groups including a first and a second group, the first group including only defects having a reported size that is at least as small as a first predetermined size and the second group including only defects having a reported size that is at least as large as the first predetermined size; selecting for further review, defects from the second and first groups respectively in a ratio of Ny;
Nx, where Ny/Nx is larger than the ratio of the number of defects in the second group to the number of defects in the first group. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20)
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Specification