Pulsed nucleation deposition of tungsten layers

• US 7,211,144 B2
• Filed: 07/12/2002
• Issued: 05/01/2007
• Est. Priority Date: 07/13/2001
• Status: Expired due to Term

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Lu, Xinliang, Xi, Ming, Mak, Alfred W., Jackson, Robert L., Yoo, Jong Hyun, Lai, Ken Kaung, Jian, Ping
• Primary Examiner(s): KUNEMUND, ROBERT M
• Application Number:
  US10/194,629
• Publication Number:
  US 20030127043A1
• Time in Patent Office: 1,754 Days
• Field of Search: 117/101, 117/102, 117/105, 117/89, 117/85, 117/86
• US Class Current: 117/101
• CPC Class Codes: C23C 16/14 Deposition of only one other metal element
• CPC Class Codes: C23C 16/45523 Pulsed gas flow or change of composition over time
• CPC Class Codes: C23C 16/45525 Atomic layer deposition [ALD]
• CPC Class Codes: C30B 25/02 Epitaxial-layer growth
• CPC Class Codes: C30B 29/02 Elements
• CPC Class Codes: H01L 21/28562 Selective deposition

Abstract

A method of forming a tungsten nucleation layer using a sequential deposition process. The tungsten nucleation layer is formed by reacting pulses of a tungsten-containing precursor and a reducing gas in a process chamber to deposit tungsten on the substrate. Thereafter, reaction by-products generated from the tungsten deposition are removed from the process chamber. After the reaction by-products are removed from the process chamber, a flow of the reducing gas is provided to the process chamber to react with residual tungsten-containing precursor remaining therein. Such a deposition process forms tungsten nucleation layers having good step coverage. The sequential deposition process of reacting pulses of the tungsten-containing precursor and the reducing gas, removing reaction by-products, and than providing a flow of the reducing gas to the process chamber may be repeated until a desired thickness for the tungsten nucleation layer is formed.

Claims

1. A method for depositing a tungsten nucleation layer on a substrate within a process chamber, comprising:

(a) providing a flow of a gas mixture comprising a tungsten-containing precursor and a reducing gas into a process chamber to deposit a tungsten nucleation layer on a substrate;

(b) removing reaction by-products generated during step (a) from the process chamber;

(c) providing a flow of the reducing gas into the process chamber to react with residual tungsten-containing precursor in the process chamber and deposit tungsten on the substrate;

(d) removing reaction by-products generated during step (c) from the process chamber; and

(e) repeating steps (a)–

(d).

2. The method of claim 1 further comprising repeating step (e) until a tungsten nucleation layer thickness of up to about 500 Å

is deposited.

3. The method of claim 1 wherein the tungsten-containing precursor comprises tungsten hexafluoride.

4. The method of claim 1 wherein the reducing gas in steps (a) and (c) is selected from the group consisting of silane, disilane, borane, diborane, derivatives thereof and combinations thereof.

5. The method of claim 1 wherein the gas mixture of step (a) is provided for a time period of about 0.1 seconds to about 10 seconds.

6. The method of claim 1 wherein the tungsten-containing precursor and the reducing gas are provided in a tungsten-containing precursor:

reducing gas ratio of about 1;

1 to about 5;

1.

7. The method of claim 1 wherein the reaction by-products in steps (b) and (d) are removed from the process chamber by providing a purge gas thereto and evacuating both the purge gas and the reaction by-products therefrom.

8. The method of claim 7 wherein the purge gas comprises on or more gases selected from the group consisting of nitrogen, helium, argon and combinations thereof.

9. The method of claim 7 wherein the purge gas is provided to the process chamber for up to about 10 seconds.

10. The method of claim 1 wherein the reducing gas of step (c) is provided to the process chamber for up to about 10 seconds.

11. The method of claim 1 wherein time periods for steps (b) and (c) overlap.

12. A method for depositing a tungsten nucleation layer on a substrate within a process chamber, comprising:

(a) providing a flow of a gas mixture comprising a tungsten-containing precursor and a reducing gas into a process chamber for about 0.1 seconds to about 10 seconds to deposit a tungsten nucleation layer on a substrate;

(b) removing reaction by-products generated during step (a) by providing a purge gas into the process chamber and evacuating both the purge gas and the reaction by-products therefrom;

(c) providing a flow of the reducing gas into the process chamber for up to about 10 seconds to react with residual tungsten-containing precursor in the process chamber and deposit tungsten on the substrate;

(d) removing reaction by-products generated during step (c) by providing a purge gas into the process chamber and evacuating both the purge gas and the reaction by-products therefrom; and

(e) repeating steps (a)–

(d) until a tungsten nucleation layer thickness of up to about 500 Å

is deposited.

13. The method of claim 12 wherein the tungsten-containing precursor comprises tungsten hexafluoride.

14. The method of claim 12 wherein the reducing gas in steps (a) and (c) is selected from the group consisting of silane, disilane, borane, diborane, derivatives thereof and combinations thereof.

15. The method of claim 12 wherein the tungsten-containing precursor and the reducing gas are provided in a tungsten-containing precursor:

reducing gas ratio of about 1;

1 to about 5;

1.

16. The method of claim 12 wherein the purge gas of steps (b) and (d) comprises one or more gases selected from the group consisting of nitrogen, helium, argon and combinations thereof.

17. The method of claim 12 wherein the purge gas of steps (b) and (d) is provided to the process chamber for up to about 10 seconds.

18. The method of claim 12 wherein time periods for steps (b) and (C) overlap.

19. A method for depositing a tungsten nucleation layer on a substrate within a process chamber, comprising:

(a) providing a flow of a gas mixture comprising tungsten hexafluoride and silane into a process chamber for about 0.1 seconds to about 10 seconds to deposit a tungsten nucleation layer on a substrate;

(b) removing reaction by-products generated during step (a) by providing a purge gas into the process chamber and evacuating both the purge gas and the reaction by-products therefrom;

(c) providing a flow of silane into the process chamber for up to about 10 seconds to react with residual tungsten hexafluoride in the process chamber and deposit tungsten on the substrate;

(d) removing reaction by-products generated during step (c) by providing a purge gas into the process chamber and evacuating both the purge gas and the reaction by-products therefrom; and

(e) repeating steps (a)–

(d) until a tungsten nucleation layer thickness of up to about 500 Å

is deposited.

20. The method of claim 19 wherein the tungsten hexafluoride and the silane are provided in a tungsten hexafluoride:

silane ratio of about 1;

1 to about 5;

1.

21. The method of claim 19 wherein the purge gas of steps (b) and (d) comprises one or more gases selected from the group consisting of nitrogen, helium, argon and combinations thereof.

22. The method of claim 19 wherein the purge gas of steps (b) and (d) is provided to the process chamber for up to about 10 seconds.

23. The method of claim 19 wherein time periods for steps (b) and (c) overlap.

24. A method for depositing a tungsten nucleation layer on a substrate within a process chamber, comprising:

exposing a substrate to a gas mixture containing a tungsten precursor and a reducing gas for depositing a tungsten nucleation layer for about 0.1 seconds to about 10 seconds within a process chamber during a deposition step;

exposing the process chamber to a first purge step that includes providing a purge gas into the process chamber and evacuating the process chamber;

exposing the substrate to diborane or silane during a soak step;

exposing the process chamber to a second purge step that includes providing the purge gas into the process chamber and evacuating the process chamber; and

repeating the deposition step and the first purge step until the tungsten nucleation layer is formed with a predetermined thickness.

25. A method for depositing a tungsten nucleation layer on a substrate within a process chamber, comprising:

exposing a substrate to a gas mixture containing a tungsten precursor and a reducing gas for about 0.1 seconds to about 10 seconds within a process chamber during a deposition step;

exposing the process chamber to a purge step that includes providing a purge gas into the process chamber and evacuating the process chamber;

repeating the deposition step and the purge step until a tungsten nucleation layer is formed with a predetermined thickness; and

depositing a tungsten bulk layer on the tungsten nucleation layer during a second vapor deposition process.