Method of forming insulating layer in semiconductor device
First Claim
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1. A method of forming an insulating film in a semiconductor device, comprising the steps of:
- mounting the semiconductor substrate in which a lower structure is formed into the deposition equipment;
supplying a source gas containing silicon component and a reaction gas containing oxygen component into the deposition equipment;
applying radio frequency powers which are mixture of a first radio frequency power having a short pulse wave generated from a first RF device with a second radio frequency power having a background pulse wave generated from a second RE device;
generating incomplete gas phase reaction during the time when the first radio frequency power is applied, so that an insulating film including nano particles are deposited; and
oxidizing the nano particles during the time when the first radio frequency power is not applied, so that nano voids are formed within the insulating film, andwherein the first radio frequency power has low amplitude and the second radio frequency power has high amplitude.
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Abstract
The present invention relates to a method of forming an insulating film in a semiconductor device. After a mixed gas of alkyl silane gas and N2O gas is supplied into the deposition equipment, a radio frequency power including a short pulse wave for causing incomplete reaction upon a gas phase reaction is applied to generate nano particle. The nano particle is then reacted to oxygen radical to form the insulating film including a plurality of nano voids. A low-dielectric insulating film that can be applied to the nano technology even in the existing LECVD equipment is formed.
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18 Claims
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1. A method of forming an insulating film in a semiconductor device, comprising the steps of:
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mounting the semiconductor substrate in which a lower structure is formed into the deposition equipment; supplying a source gas containing silicon component and a reaction gas containing oxygen component into the deposition equipment; applying radio frequency powers which are mixture of a first radio frequency power having a short pulse wave generated from a first RF device with a second radio frequency power having a background pulse wave generated from a second RE device; generating incomplete gas phase reaction during the time when the first radio frequency power is applied, so that an insulating film including nano particles are deposited; and oxidizing the nano particles during the time when the first radio frequency power is not applied, so that nano voids are formed within the insulating film, and wherein the first radio frequency power has low amplitude and the second radio frequency power has high amplitude. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A method of forming an insulating film in a semiconductor device, comprising the steps of:
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mounting the semiconductor substrate in which a lower structure is formed into the deposition equipment; supplying a source gas containing silicon component and a reaction gas containing oxygen component into the deposition equipment; depositing the insulating film by using plasma wave RF; applying a first radio frequency power having a short pulse wave RF generated from a first RF device with a second radio frequency power having a background wave RF generated from a second RF device to form nano particles within the insulating film; and applying the second radio frequency power only to form nano voids within the insulating film, and wherein the first radio frequency powers is periodically iteratively applied, the step of forming the nano particle and the step of forming nano void are iteratively performed. - View Dependent Claims (13, 14, 15, 16, 17, 18)
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Specification