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Flip chip in leaded molded package and method of manufacture thereof

  • US 7,215,011 B2
  • Filed: 08/25/2005
  • Issued: 05/08/2007
  • Est. Priority Date: 12/16/1999
  • Status: Expired due to Term
First Claim
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1. A semiconductor die package comprising:

  • a leadframe;

    a die that includes a backside, wherein the backside of the die forms a first electrical terminal;

    solder coupling a frontside of the die to the leadframe, wherein the frontside of the die comprises a second electrical terminal, and wherein the first electrical terminal and the second electrical terminal are terminals in a MOSFET device; and

    a body including an encapsulating material that encapsulates the die such that the backside of the die is adjacent to a window defined within the body, wherein the leadframe has leads and wherein ends of the leads of the leadframe are substantially coplanar with the backside of the die.

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