Surface acoustic wave device

• US 7,215,223 B2
• Filed: 01/12/2005
• Issued: 05/08/2007
• Est. Priority Date: 01/13/2004
• Status: Active Grant

• Current Assignee: Taiyo Yuden Company Limited (Taiyo Yuden Co)
• Original Assignee: Fujitsu Media Devices Limited (Fujitsu Limited)
• Inventors: Kawachi, Osamu, Hattanda, Tomoka
• Primary Examiner(s): TAKAOKA, DEAN O
• Application Number:
  US11/033,274
• Publication Number:
  US 20050151602A1
• Time in Patent Office: 846 Days
• Field of Search: 333/133, 333/193, 310/313.R, 310/313.B, 257/778
• US Class Current: 333/193
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/14 of a plurality of bump connectors
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H03H 9/059 consisting of mounting pads or bumps
• CPC Class Codes: H03H 9/1071 the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
• CPC Class Codes: H03H 9/6436 having one acoustic track only
• CPC Class Codes: H03H 9/6483 Ladder SAW filters

Abstract

A surface acoustic wave (SAW) device includes a SAW chip including comb-like electrodes arranged on a piezoelectric substrate, and a package on which the SAW chip is flip-chip mounted, the package including an interconnection that connects the comb-like electrodes. Resonators are connected to signal interconnection pads through the interconnection pattern. IDTs in a three-IDT multimode filter are respectively connected to the signal interconnection pads via another interconnection pattern. The signal interconnection pads are connected to a signal interconnection provided on a chip mounting surface with bumps. Then, a part of the interconnection pattern connecting the resonators is extracted onto the package. It is thus possible to design the interconnections on the package flexibly and thereby easy to adjust the impedance of the interconnections that connect the resonators.

Claims

1. A surface acoustic wave (SAW) device comprising:

a SAW chip including comb-like electrodes arranged on a piezoelectric substrate; and

a package on which the SAW chip is flip-chip mounted,

the package including an interconnection that connects the comb-like electrodes, the interconnection being thicker than the comb-like electrodes,

wherein the package comprises a laminated body, and the interconnection of the package is provided in the laminated body.

2. A surface acoustic wave (SAW) device comprising:

a SAW chip including comb-like electrodes arranged on a piezoelectric substrate; and

a package on which the SAW chip is flip-chip mounted, the package including an interconnection that connects the comb-like electrodes, the interconnection being thicker than the comb-like electrodes, and

further comprising interconnections that connect the comb-like electrodes, wherein a part of multiple interconnections is provided in the package.