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Surface acoustic wave device

  • US 7,215,223 B2
  • Filed: 01/12/2005
  • Issued: 05/08/2007
  • Est. Priority Date: 01/13/2004
  • Status: Active Grant
First Claim
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1. A surface acoustic wave (SAW) device comprising:

  • a SAW chip including comb-like electrodes arranged on a piezoelectric substrate; and

    a package on which the SAW chip is flip-chip mounted,the package including an interconnection that connects the comb-like electrodes, the interconnection being thicker than the comb-like electrodes,wherein the package comprises a laminated body, and the interconnection of the package is provided in the laminated body.

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