Surface mount coil component and surface mount coil component mounted substrate

• US 7,215,232 B2
• Filed: 09/30/2005
• Issued: 05/08/2007
• Est. Priority Date: 09/30/2004
• Status: Active Grant

• Current Assignee: Taiyo Yuden Company Limited (Taiyo Yuden Co)
• Original Assignee: Taiyo Yuden Company Limited (Taiyo Yuden Co)
• Inventors: Ogawa, Hideki, Aoki, Hidenori, Wada, Kouichirou
• Primary Examiner(s): Enad; Elvin
• Assistant Examiner(s): YU, JUSTINE ROMANG
• Application Number:
  US11/241,276
• Publication Number:
  US 20060071749A1
• Time in Patent Office: 585 Days
• Field of Search: 336/83
• US Class Current: 336/83
• CPC Class Codes: H01F 17/045 with core of cylindric geometry and coil wound along its longitudinal axis, i.e. rod or drum core
• CPC Class Codes: H01F 27/292 Surface mounted devices
• CPC Class Codes: H01F 41/10 Connecting leads to windings making electric connections in general H01R43/00
• CPC Class Codes: H05K 3/3442 having edge contacts, e.g. leadless chip capacitors, chip carriers

Abstract

A surface mount coil component has an electrode part including: internal electrodes mounted on both flanges of a drum type core over bottom surfaces and wraparound portions extending from the bottom surfaces to the end surfaces and parts of both sides. The coil conductor is conductively joined to the internal electrodes at both ends thereof. Intermediate electrodes cover from the top sides of wraparound portions of the internal electrodes on the sides of the flanges through top sides of the wraparound portion thereof on the end surfaces of the flanges to top sides of the wraparound portion thereof on the other sides of the flanges so as to leave C-shaped cross section of exposed areas of the internal electrodes. Also, plating conductive films extend from surfaces of the exposed areas of the internal electrodes to surfaces of the intermediate electrodes.

Claims

1. A surface mount coil component comprising:

internal electrodes each formed on a core near both ends thereof from bottom surfaces to wraparound portions which extend at least from the bottom surfaces to end surfaces and parts of both sides;

intermediate electrodes extending from top sides of the wraparound portions of the internal electrodes on one side through the top sides of the wraparound portions of the internal electrodes on the end surfaces to the top sides of the wraparound portions of the internal electrodes on the other side and covering the internal electrodes of the bottom surfaces;

wherein one or more areas of the internal electrodes are not covered by the intermediate electrodes, and wherein said one or more areas have a substantially C-shaped cross section; and

conductive films covering the surfaces of the one or more areas of the internal electrodes not covered by the intermediate electrodes and the surfaces of the intermediate electrodes.

2. The surface mount coil component according to claim 1, wherein the core is pillar-shaped.

3. A surface mount coil component according to claim 1, wherein:

the internal electrodes are mounted on bottom surfaces at both flanges of a drum type core and wraparound portions extending from the bottom surfaces to the end surfaces and parts of both sides;

a coil conductor is wound around a winding core part of the drum type core, the coil conductor being conductively joined to the internal electrodes at the ends thereof;

intermediate electrodes extend from top sides of wraparound portions of the internal electrodes to the sides of the flanges, to the end surfaces of the flanges, and to the other sides of the flanges and covering the internal electrodes of the bottom surfaces; and

exposed areas on side surfaces of the internal electrodes extend from under the intermediate electrodes.

4. The surface mount coil component according to claim 1, wherein the conductive film comprises a plating film.

5. A surface mount coil component electronic device comprising:

a substrate; and

a surface mount coil component disposed on the substrate, the surface mount coil component comprising;

internal electrodes each formed on a core near both ends thereof from bottom surfaces to wraparound portions which extend at least from the bottom surfaces to end surfaces and parts of both sides;

intermediate electrodes extending from top sides of the wraparound portions of the internal electrodes on one, side through the top sides of the wraparound portions of the internal electrodes on the end surfaces to the top sides of the wraparound portions of the internal electrodes on the other side and covering the internal electrodes of the bottom surfaces;

wherein one or more areas of the internal electrodes are not covered by the intermediate electrodes; and

conductive films covering the surfaces of the one or more areas of the internal electrodes not covered by the intermediate electrodes and the surfaces of the intermediate electrodes.

6. The surface mount component electronic device according to claim 5, wherein the surface mount coil component comprises a pillar-shaped core.

7. The surface mount coil component electronic device according to claim 5, wherein the surface mount coil component comprises:

a drum type core;

internal electrodes mounted on bottom surfaces at both flanges of the drum type core and wraparound portions extending from the bottom surfaces to end surfaces and parts of both sides;

a coil conductor wound around a winding core part of the drum type core, the coil conductor being conductively joined to the internal electrodes at the ends of the coil conductor; and

intermediate electrodes extending from top sides of the wraparound portions of the internal electrodes to the sides of the flanges, to the end surfaces of the flanges, and to the other sides of the flanges and covering the internal electrodes of the bottom surfaces.

8. The surface mount coil component electronic device according to claim 5, wherein the conductive film comprises a plating film.