Integrated cooling system for electronic devices
First Claim
1. A method for producing an electronic assembly with an integrated cooling system comprising the steps of:
- (a) fabricating a base defining an integrated cooling system comprising a fluid channel for receiving a cooling fluid; and
(b) attaching at least one electrical component on the base;
(c) fabricating a plurality of micro-channels within the at least one electrical component; and
(d) attaching a cap to the base over the at least one electrical component to provide a cap space in fluid communication with the fluid channel for receiving and retaining the cooling fluid, the plurality of micro-channels being in fluid communication with the cap space;
whereby heat generated from the at least one electrical component is transferable to the cooling fluid to be dissipated.
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Accused Products
Abstract
The present invention provides a method for producing an electronic assembly and an electronic assembly with an integrated cooling system for dissipating heat. The electronic assembly comprises a base; and at least one electrical component attached to the base. The base defines an integrated cooling system having a fluid channel spanning within the base and at least one heat exchanger in heat communication with the fluid channel. The integrated cooling system may further include a pump attached to the base for directing the flow of the fluid within the fluid channel, and a port in fluid communication with the fluid channel for receiving fluid from an external source.
86 Citations
31 Claims
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1. A method for producing an electronic assembly with an integrated cooling system comprising the steps of:
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(a) fabricating a base defining an integrated cooling system comprising a fluid channel for receiving a cooling fluid; and (b) attaching at least one electrical component on the base; (c) fabricating a plurality of micro-channels within the at least one electrical component; and (d) attaching a cap to the base over the at least one electrical component to provide a cap space in fluid communication with the fluid channel for receiving and retaining the cooling fluid, the plurality of micro-channels being in fluid communication with the cap space; whereby heat generated from the at least one electrical component is transferable to the cooling fluid to be dissipated. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. An electronic assembly comprising:
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a base; and a fluid channel spanning within the base for receiving and transporting a cooling fluid therein; at least one electrical component attached to the base, the base defining an integrated cooling system in thermal communication with the at least one electrical component for dissipating heat from the at least one electrical component; a cap sealed on the base and enclosing the at least one electrical component on the base, the cap defining a cap space surrounding the at least one electrical component and in fluid communication with the fluid channel for receiving and retaining cooling fluid; wherein the electrical component includes a plurality of micro-channels in fluid communication with the cap space. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31)
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Specification