EMI shield for transceiver

• US 7,215,558 B2
• Filed: 01/05/2005
• Issued: 05/08/2007
• Est. Priority Date: 12/27/2001
• Status: Expired due to Term

• Current Assignee: NeoPhotonics Corporation (Lumentum Holdings Inc.)
• Original Assignee: Intel Corporation
• Inventors: Oen, Joshua T., Petit, Todd Micheal, Schultz, Craig L.
• Primary Examiner(s): Dinh; Tuan
• Application Number:
  US11/030,003
• Publication Number:
  US 20050130495A1
• Time in Patent Office: 853 Days
• Field of Search: 361752-753, 361/816, 361/818, 174/35.R
• US Class Current: 361/816
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 9/0007 Casings standardised racks H05K9/0062

Abstract

An integrated circuit packages comprises a printed circuit board, a non-metal connector, and a metal casing. The printed circuit board includes a ground ring around the non-metal connector. The metal casing substantially encloses the printed circuit board, and has an opening that allows access to the non-metal connector. The metal casing has a metal lip that makes physical and electrical contact with the ground ring of the printed circuit board. The metal casing may be used to help reduce EMI from a transmitter.

Claims

1. An integrated circuit package comprising:

a printed circuit board having a ground ring thereon which is electrically connected to a ground plane of the printed circuit board by vias;

a connector attached to the printed circuit board within the ground ring;

a metal casing substantially enclosing the printed circuit board but not enclosing the connector, the metal casing having a lip to make electrical contact with the ground ring, the metal casing having a top portion that substantially covers a top portion of the printed circuit board, and a bottom portion that substantially covers a bottom portion of the printed circuit board, wherein the top and bottom portions of the metal casing at least partially overlap; and

a first perimeter ground ring on the printed circuit board that at least partially encloses the ground ring, the first perimeter ground ring electrically coupled with the ground plane and at least one of the top and bottom portions of the metal casing.

2. The integrated circuit package of claim 1, wherein the top portion of the metal casing at least partially overlaps a perimeter of the bottom portion of the metal casing.

3. The integrated circuit package of claim 1, wherein the top portion of the metal casing comprises an opening to allow access to the connector.

4. The integrated circuit package of claim 1, further comprising a metal shield that covers an oscillator of a transmitter of the package but does not cover a phase lock loop of the transmitter or a multiplexer of a serializer of the transmitter.

5. The integrated circuit package of claim 1, further comprising:

fins of the bottom portion of the metal casing;

a metal shield covering an oscillator of a transmitter tat is coupled with the printed circuit board but not covering one or more components selected from a phase lock loop of the transmitter, a multiplexer of a serializer of the transmitter, and a clock multiplier unit of the serializer of the transmitter;

vias electrically coupling the first perimeter ground ring with the ground plane;

a first conductive gasket between a portion of the metal casing and a ground ring;

a second conductive gasket between the top portion of the metal casing and the bottom portion of the metal casing;

a third conductive gasket between the lip and the ground ring.

6. A transmitter comprising:

a printed circuit board having a top surface and a bottom surface, the top surface having a top perimeter ground ring, and the bottom surface having a bottom perimeter ground ring, the top perimeter ground ring surrounding a perimeter of the top surface of the printed circuit board, the bottom perimeter ground ring surrounding a perimeter of the bottom surface of the printed circuit board;

a top metal casing portion covering a top portion of the printed circuit board, the top metal casing portion electrically connected with the top perimeter ground ring, the top metal casing portion having an opening to allow access to a connector attached to the printed circuit;

a bottom metal casing portion covering a bottom portion of the printed circuit board, the bottom metal casing portion electrically connected with the bottom perimeter ground ring, wherein the top and bottom metal casing portions at least partially overlap; and

a third ground ring surrounding the connector and electrically coupled with the top metal casing portion.

7. The transmitter of claim 6, further comprising:

fins of the bottom metal casing portion;

a metal shield covering an oscillator of the transmitter but not covering one or more components selected from a phase lock loop of the transmitter, a multiplexer of a serializer of the transmitter, and a clock multiplier unit of the serializer of the transmitter;

vias electrically coupling the top perimeter ground ring, the bottom perimeter ground ring, the ground ring, and a ground plane of the printed circuit board together;

a lip of the top metal casing portion to electrically couple the top metal casing portion with the third ground ring;

a first conductive gasket between a metal casing portion and a ground ring;

a second conductive gasket between the top metal casing portion and the bottom metal casing portion; and

a third conductive gasket between the lip and the third ground ring.