Multipath interconnect with meandering contact cantilevers

• US 7,217,138 B2
• Filed: 05/09/2005
• Issued: 05/15/2007
• Est. Priority Date: 11/03/2003
• Status: Expired due to Term

• Current Assignee: K&S Interconnect, Inc., New Jersey Institute of Technology, Smiths Interconnect Americas, Inc. (Smiths Group International Holdings Ltd.)
• Original Assignee: Antares conTech, Inc. (Sensata Technologies Holding Plc)
• Inventors: Kister, January, Jaquette, James, Fahrner, Steve
• Primary Examiner(s): Patel; Tulsidas C.
• Assistant Examiner(s): Nguyen; PhuongChi
• Application Number:
  US11/125,035
• Publication Number:
  US 20050196980A1
• Time in Patent Office: 736 Days
• Field of Search: 439/66, 439/71, 439/70, 439/81, 439/67, 439/767, 439/60
• US Class Current: 439/66
• CPC Class Codes: H01R 12/714 with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
• CPC Class Codes: H01R 13/2407 characterized by the resilient means
• CPC Class Codes: H01R 13/2428 using meander springs
• CPC Class Codes: H01R 13/2485 for contacting a ball

Abstract

An interconnect assembly includes a number of interconnect stages combined in a carrier structure. Each interconnect stage includes at least two contact sets having an upwards pointing cantilever contact and a downwards pointing cantilever contact. The cantilever contacts are attached to the carrier structure and are arranged around openings in the carrier structure such that the downward pointing cantilevers may reach through the carrier structure. Each contact set defines an independent conductive path between a single pair of opposing chip and test apparatus contacts such that multiple conductive paths are available for each interconnect stage for increased transmission reliability and reduced resistance. The cantilever contacts have a meandering contour and are either combined in symmetrical pairs at their respective tips or are free pivoting. The meandering contour provides a maximum deflectable cantilever length within an available footprint defined by the pitch of the tested chip.

Claims

1. An interconnect assembly for providing electrical interconnection between a device to be tested and a testing system, the interconnect assembly comprising:

a carrier structure defining a plurality of openings therethrough; and

a plurality of resilient electrical contact structures supported by the carrier structure, each of the plurality of resilient electrical contact structures comprising (a) a base portion planar with a surface of the carrier structure such that a first surface of the base portion is in contact with the surface of the carrier structure and a second surface of the base portion opposite the first surface is exposed, (b) a first resilient contact portion shaped to extend above the carrier structure such that the first contact portion is bent with respect to the base portion along a first bending axis, wherein the first contact portion further includes a first bow that is substantially coplanar with the first contact portion, and (c) a second resilient contact portion shaped to extend below the carrier structure such that the second contact portion is bent wit respect to the base portion along a second bending axis, wherein the second contact portion further includes a second bow that is substantially coplanar with the second contact portion, wherein one of the first contact portion or the second contact portion extends through a corresponding one of the plurality of openings defined by the carrier structure.

2. The interconnect assembly of claim 1 wherein the base portion, the first resilient contact portion, and the second resilient contact portion are monolithic.

3. The interconnect assembly of claim 1 wherein one of the first resilient contact portion and the second resilient contact portion is configured to contact a contact pad of a device to be tested, and the other of the first resilient contact portion and the second resilient contact portion is configured to contact a contact pad of a testing system.

4. The interconnect assembly of claim 1 wherein the earner structure is non-conductive.

5. The interconnect assembly of claim 1 wherein the first resilient contact portion and the second resilient contact portion are mirror images of one another with respect to the base portion.

6. The interconnect assembly of claim 1 wherein at least one of the first resilient contact portion or the second resilient contact portion comprises multiple conductive paths.

7. The interconnect assembly of claim 1 wherein the plurality of resilient electrical contact structures comprise NiMn.

8. The interconnect assembly of claim 1 wherein one of the first resilient contact portion and the second resilient contact portion extends to a first tip portion configured to contact a contact pad of a device to be tested, and the other of the first resilient contact portion and the second resilient contact portion extends to a second tip portion configured to contact a contact pad of a testing system.

9. An interconnect assembly for providing electrical interconnection between (b 1) a packaged integrated circuit device to be tested and (2) a testing system, the interconnect assembly comprising:

a carrier structure defining a plurality of openings therethrough; and

a plurality of resilient electrical contact structures supported by the carrier structure, each of the plurality of resilient electrical contact structures comprising (a) a base portion planar with a surface of the carrier structure such that a first surface of the base portion is in, contact with the surface of the carrier structure and a second surface of the base portion opposite the first surface is exposed, (b) a first resilient contact portion shaped to extend above the carrier structure such that the first contact portion is bent with respect to the base portion along a first bending axis, wherein the first contact portion further includes a first bow that is substantially coplanar with the first contact portion, and (c) a second resilient contact portion shaped to extend below the carrier structure such that the second contact portion is bent with respect to the base portion along a second bending axis, wherein the second contact portion further includes a second bow that is substantially coplanar with the second contact portion, wherein one of the first contact portion or the second contact portion extends through a corresponding one of the plurality of openings defined by the carrier structure, and wherein the base portion, the first resilient contact portion, and the second resilient contact portion are monolithic.

10. The interconnect assembly of claim 9 wherein one of the first resilient contact portion and the second resilient contact portion is configured to contact a contact pad of a device to be tested, and the other of the first resilient contact portion and the second resilient contact portion is configured to contact a contact pad of a testing system.

11. The interconnect assembly of claim 9 wherein the carrier structure is non-conductive.

12. The interconnect assembly of claim 9 wherein the first resilient contact portion and the second resilient contact portion are mirror images of one another with respect to the base portion.

13. The interconnect assembly of claim 9 wherein at least one of the first resilient contact portion or the second resilient contact portion comprises multiple conductive paths.

14. The interconnect assembly of claim 9 wherein the plurality of resilient electrical contact structures comprise NiMn.

15. The interconnect assembly of claim 9 wherein one of the first resilient contact portion and the second resilient contact portion extends to a first tip portion configured to contact a contact pad of a device to be tested, and the other of the first resilient contact portion and the second resilient contact portion extends to a second tip portion configured to contact a contact pad of a testing system.

16. An interconnect assembly for providing electrical interconnection between a device to be tested and a testing system, the interconnect assembly comprising:

a non-conductive carrier structure defining a plurality of openings therethrough; and

a plurality of resilient electrical contact structures supported by the carrier structure, each of the plurality of resilient electrical contact structures comprising (a) a base portion planar with a surface of the carrier structure such that a first surface of the base portion is in contact with the surface of the carrier structure and a second surface of the base portion opposite the first surface is exposed, (b) a first resilient contact portion shaped to extend above the carrier structure such that the first contact portion is bent with respect to the base portion alone a first bending axis, wherein the first contact portion further includes a first bow that is substantially coplanar with the first contact portion and (c) a second resilient contact portion shaped to extend below the carrier structure such that the second contact portion is bent with respect to the base portion along a second bending axis, wherein the second contact portion further includes a second bow that is substantially coplanar with the second contact portion, wherein one of the first contact portion or the second contact portion extends through a corresponding one of the plurality of openings defined by the carrier structure, and wherein the base portion, the first resilient contact portion, and the second resilient contact portion are monolithic,

one of the first resilient contact portion and the second resilient contact portion being configured to contact a contact pad of a device to be tested, and the other of the first resilient contact portion and the second resilient contact portion being configured to contact a contact pad of a testing system.

17. The interconnect assembly of claim 16 wherein the first resilient contact portion and the second resilient contact portion are mirror images of one another with respect to the base portion.

18. The interconnect assembly of claim 16 wherein at least one of the first resilient contact portion or the second resilient contact portion comprises multiple conductive paths.

19. The interconnect assembly of claim 16 wherein the plurality of resilient electrical contact structures comprise NiMn.

20. The interconnect assembly of claim 16 wherein one of the first resilient contact portion and the second resilient contact portion extends to a first tip portion configured to contact a contact pad of a device to be tested, and the other of the first resilient contact portion and the second resilient contact portion extends to a second tip portion configured to contact a contact pad of a testing system.