Integrated MEMS packaging

• US 7,217,588 B2
• Filed: 07/08/2005
• Issued: 05/15/2007
• Est. Priority Date: 01/05/2005
• Status: Active Grant

• Current Assignee: Sharp Kabushiki Kaisha (Hon Hai Precision Industry Co., Ltd.)
• Original Assignee: Sharp Laboratories of America Incorporated (Hon Hai Precision Industry Co., Ltd.)
• Inventors: Hartzell, John W., Brownlow, Michael James, Walton, Harry Garth
• Primary Examiner(s): LE, DUNG ANH
• Application Number:
  US11/178,148
• Publication Number:
  US 20060148137A1
• Time in Patent Office: 676 Days
• Field of Search: 438 48- 51, 438113-119, 257/730, 257/777, 257/569, 257/678
• US Class Current: 438/51
• CPC Class Codes: B81C 1/0023 Packaging together an electronic processing unit die and a micromechanical structure die MEMS packages B81B7/0032; MEMS packaging processes B81C1/00261
• CPC Class Codes: H01L 27/1214 comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs

Abstract

An integrated MEMS package and associated packaging method are provided. The method includes: forming an electrical circuit, electrically connected to the first substrate; integrating a MEMS device on a first substrate region, electrically connected to the first substrate; providing a second substrate overlying the first substrate; and, forming a wall along the first region boundaries, between the first and second substrate. In one aspect, the electrical circuit is formed using thin-film processes; and, wherein integrating the MEMS device on the first substrate region includes forming the MEMS using thin-film processes, simultaneous with the formation of the electrical device. Alternately, the MEMS device is formed in a separate process, attached to the first substrate, and electrical interconnections are formed to the first substrate using thin-film processes.

Claims

1. An integrated microelectromechanical system (MEMS) device package, the MEMS integrated package comprising:

a first substrate having a first region with boundaries;

an electrical circuit on a second region of the first substrate, electrically connected to the first substrate;

a MEMS device environmental sensor on the first region, electrically connected to the first substrate;

a second substrate overlying the first substrate, having an opening overlying the first substrate first region, exposing the MEMS device to a first environment via the second substrate opening; and

,

a wall along the first region boundaries, between the first and second substrates, isolating the MEMS device from the electrical circuit.

2. The MEMS integrated package of claim 1 wherein the wall encloses the MEMS device between the first and second substrates along the first region boundaries.

3. The MEMS integrated package of claim 1 wherein the MEMS is a micro-fluidic MEMS;

and,

wherein the second substrate opening exposes the micro-fluidic MEMS to a fluid environment.

4. The MEMS integrated package of claim 1 wherein the electrical circuit on the second region of the first substrate is an active circuit including a TFT, electrically connected to the MEMS;

and,

wherein the wall separates the TFT, exposed to a first environment, from the MEMS, exposed to a second environment.

5. The MEMS integrated package of claim 1 wherein the wall is a cured sealant.

6. The MEMS integrated package of claim 1 further comprising:

a plurality of uniform-shaped spacers applied to the first substrate; and

,

wherein the wall is a cured sealant, with a uniform height between the first and second substrates, response to the spacers.

7. The MEMS integrated package of claim 1 wherein the first substrate includes a plurality of regions with boundaries;

the MEMS integrated package further comprising;

a plurality of MEMS devices on the first substrate, each in a corresponding region; and

,

a plurality of walls, each wall formed around the boundaries of a corresponding region of the first substrate.

8. The MEMS integrated package of claim 1 further comprising:

a boundary assembly shape matching the first region boundaries, and having a height; and

,

wherein the wall comprises the boundary assembly attached to the first substrate along the first region boundaries, separating the first substrate from the second substrate by the boundary assembly height.

9. An integrated microelectromechanical system (MEMS) device package, the MEMS integrated package comprising:

a liquid crystal display (LCD) substrate having a perimeter and a first region with boundaries;

an electrical circuit on a second region of the first substrate, electrically connected to the first substrate;

a MEMS device on the first region, electrically connected to the first substrate;

a color filter substrate overlying the LCD substrate; and

,

a seal formed along the perimeters of the display substrate and color filter substrate; and

,

a cavity between the display substrate and the color filter substrate, bounded by the seal.

10. The MEMS integrated package of claim 9 further comprising:

liquid crystal material in the cavity.

11. The MEMS integrated package of claim 9 wherein the color filter substrate has an opening through the substrate, overlying the first substrate first region;

wherein the MEMS device is a MEMS microphone.

12. The MEMS integrated package of claim 9 wherein the seal encloses the MEMS device between the LCD and color filter substrates along the first region boundaries.

13. The MEMS integrated package of claim 9 wherein the seal hermetically seals the MEMS device between the LCD and color filter substrates along the first region boundaries.

14. The MEMS integrated package of claim 9 wherein the MEMS device is selected from the group including an acoustic speaker, a microphone, a radio frequency (RF) filter, an RF antenna, an accelerometer, a gyroscope, a chemical sensor, a temperature sensor, a humidity sensor, a pressure sensor, a light sensor, an infrared sensor, and an actuator.

15. An integrated microelectromechanical system (MEMS) device package, the MEMS integrated package comprising:

a first substrate having a first region and a groove formed along first region boundaries;

an electrical circuit on a second region of the first substrate, electrically connected to the first substrate;

a MEMS device on the first region, electrically connected to the first substrate;

a second substrate overlying the first substrate, with a groove formed in a region opposite the groove in the first substrate; and

,

a wall formed from an O-ring seated in the first and second substrate grooves.

16. The MEMS integrated package of claim 15 wherein the O-ring wall encloses the MEMS device between the first and second substrates along the first region boundaries.

17. The MEMS integrated package of claim 16 wherein the O-ring wall hermetically seals the MEMS device between the first and second substrates along the first region boundaries.

18. The MEMS integrated package of claim 15 wherein the MEMS device is selected from the group including an acoustic speaker, a microphone, a radio frequency (RF) filter, an RF antenna, an accelerometer, a gyroscope, a chemical sensor, a temperature sensor, a humidity sensor, a pressure sensor, a light sensor, an infrared sensor, and an actuator.

19. The MEMS integrated package of claim 15 wherein the second substrate has an opening overlying the first substrate first region, exposing the MEMS device to a first environment via the second substrate opening;

and

wherein the O-ring wall isolates the MEMS device from the electrical circuit.