Method of manufacturing a semiconductor device and semiconductor manufacturing apparatus
First Claim
1. A semiconductor device comprising:
- a polycrystalline semiconductor film as an active layer, said active layer including large tilt angle grain boundaries and small tilt angle grain boundaries,wherein n large tilt angle grain boundaries and m small tilt angle grain boundaries are cut across, when an electric current flows in the active layer,wherein the number n is equal to or less than 1, per 1 μ
m of an electric current path length,wherein the number m is equal to or greater than 1, per 1 μ
m of the electric current path length, andwherein the small tilt angle grain boundaries have differences in orientation less than 15°
in the grain boundaries;
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Abstract
A technique for manufacturing TFTs having little dispersion in their electrical characteristics is provided. Contamination of a semiconductor film is reduced by performing oxidation processing having an organic matter removing effect, forming a clean oxide film, after removing a natural oxide film formed on a semiconductor film surface. TFTs having little dispersion in their electrical characteristics can be obtained by using the semiconductor film thus obtained in active layers of the TFTs, and the electrical properties can be improved. In addition, deterioration in productivity and throughput can be reduced to a minimum by using a semiconductor manufacturing apparatus of the present invention.
51 Citations
8 Claims
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1. A semiconductor device comprising:
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a polycrystalline semiconductor film as an active layer, said active layer including large tilt angle grain boundaries and small tilt angle grain boundaries, wherein n large tilt angle grain boundaries and m small tilt angle grain boundaries are cut across, when an electric current flows in the active layer, wherein the number n is equal to or less than 1, per 1 μ
m of an electric current path length,wherein the number m is equal to or greater than 1, per 1 μ
m of the electric current path length, andwherein the small tilt angle grain boundaries have differences in orientation less than 15°
in the grain boundaries; - View Dependent Claims (2, 3, 4)
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5. A semiconductor device comprising:
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a polycrystalline semiconductor film as an active layer, said active layer including large tilt angle grain boundaries and small tilt angle grain boundaries, wherein an average size of aggregates of crystal grains having the small tilt angle grain boundaries is equal to or greater than 1 μ
m, andwherein the small tilt angle grain boundaries have differences in orientation less than 15°
in the grain boundaries. - View Dependent Claims (6, 7, 8)
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Specification