Light active sheet material

• US 7,217,956 B2
• Filed: 08/17/2004
• Issued: 05/15/2007
• Est. Priority Date: 03/29/2004
• Status: Expired due to Fees

• Current Assignee: Articulated Technologies, LLC
• Original Assignee: Articulated Technologies, LLC
• Inventors: Nelson, Gregory Victor, Daniels, John James
• Primary Examiner(s): NGO, NGAN V
• Application Number:
  US10/920,010
• Publication Number:
  US 20050211998A1
• Time in Patent Office: 1,001 Days
• Field of Search: 257/88, 257/99, 257/E33.046, 257/E33.064, 257/E33.066
• US Class Current: 257/88
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21V 5/04 of lens shape
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

Device structures for sheets of light active material. A first substrate has a transparent first conductive layer. A pattern of light active semiconductor elements are fixed to the first substrate. The light active semiconductor elements have an n-side and a p-side. Each light active semiconductor element has either of the n-side or the p-side in electrical communication with the transparent conductive layer. A second substrate has a second conductive layer. An adhesive secures the second substrate to the first substrate so that the other of said n-side or said p-side of each said light active semiconductor element is in electrical communication with the second conductive layer. Thus forming a solid-state light active device.

Claims

1. A light-emitting device, comprising:

a first substrate;

a first conductive surface on the first substrate;

a pattern of LED chips on the first conductive surface, each LED chip being preformed before being patterned on the conductive surface as an unpackaged discrete semiconductor device having an anode p-junction side and a cathode n-junction side;

a second substrate;

a second conductive surface on the second substrate;

an adhesive for fixing the first substrate to the second substrate so that either of the anode and the cathode side of each of the plurality of LED chips is in electrical communication with the first conductive surface and the other of the anode and the cathode side of each of the LED chips is in electrical communication with the second conductive surface.

2. A light-emitting device according to claim 1;

wherein the first conductive surface is formed as a conductive pattern comprised of at least one of a conductive coating, a conductive ink and a conductive adhesive.

3. A light-emitting device according to claim 1;

wherein at least one of the first and the second conductive surface is a transparent conductor.

4. A light-emitting device according to claim 1;

wherein at least one of the first and the second conductive surface is preformed on the respective first and second substrate.

5. A light-emitting device according to claim 1;

wherein the first conductive surface if formed using a printing method.

6. A light-emitting device according to claim 1;

wherein the printing method comprises at least one of an inkjet printing method, a laser printing method, a silk-screen printing method, a gravure printing method and a doner transfer sheet printing method.

7. A light-emitting device according to claim 1;

wherein the adhesive layer comprises at least one of the top substrate and the bottom substrate.

8. A light-emitting device according to claim 1;

wherein the adhesive layer comprises at least one of a conductive adhesive, a semi-conductive adhesive, an insulative adhesive, a conductive polymer, a semi-conductive polymer, and an insulative polymer.

9. A light-emitting device according to claim 1;

further comprising a function-enhancing layer between the top substrate layer and the bottom substrate layer, wherein the function-enhancing layer includes at least one of a re-emitter, a light-scatterer, an adhesive, and a conductor.

10. A light-emitting device according to claim 1;

wherein the first conductive surface comprises a transparent coating preformed on the first substrate.

11. A light-emitting device according to claim 10;

wherein the transparent coating is one of a conductive ink or conductive adhesive.

12. A light-emitting device according to claim 1;

wherein the adhesive includes an adhesive pattern formed on the first substrate for adhering the pattern of LED chips to the first substrate.

13. A light-emitting device according to claim 1;

wherein the adhesive includes an adhesive pattern formed on the first substrate for adhering the second substrate to the first substrate.

14. A light-emitting device according to claim 1;

wherein the pattern of LED chips comprises a first pattern of first light active semiconductor elements and a second pattern of second light active semiconductor elements.

15. A light-emitting device according to claim 14;

wherein the first light active semiconductor elements emit light having a first color and the second light active semiconductor elements emit light having a second color.

16. A light-emitting device according to claim 14;

wherein the first light active semiconductor elements emit light and the second light active semiconductor elements convert light to electrical energy.

17. A light-emitting device according to claim 1;

wherein said first conductive surface is formed as a grid of x-electrodes; and

said second conductive surface is formed as a grid of y-electrodes so that each respective LED chip is addressable for forming a sheet of light active material capable of functioning as a pixilated display component.

18. A light-emitting device according to claim 1;

wherein the pattern of LED chips comprises a first pattern of first color light emitting semiconductor elements, a second pattern of second color light emitting semiconductor elements and a third pattern of third color light emitting semiconductor element;

said first conductive surface being formed as a grid of x-electrodes; and

said second conductive surface being formed as a grid of y-electrodes so that each respective light active semiconductor is addressable forming a sheet of light active material capable of functioning as a full-color pixilated display component.