Low temperature process and structures for polycide power MOSFET with ultra-shallow source
First Claim
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1. A power semiconductor device, comprising:
- a semiconductor body of a first conductivity type;
a plurality of trenches along a surface of said semiconductor body and extending to a first depth of said semiconductor body;
a gate oxide layer lining surfaces of each of said plurality of trenches;
a gate electrode within each of said plurality of trenches, each gate electrode including a free end extending above the surface of said semiconductor body; and
a plurality of ultra-shallow source regions of said first conductivity type within said semiconductor body and extending to a second depth of said semiconductor body, wherein said second depth is approximately equal to or less than a thickness of said gate oxide layer.
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Abstract
A trench type power semiconductor device includes proud gate electrodes that extend out of the trenches and above the surface of the semiconductor body. These proud gate electrodes allow for making ultra-shallow source regions within the semiconductor body using, for example, a low temperature source drive. In addition, a method for manufacturing the trench type power semiconductor device includes a low temperature process flow once the gate electrodes are formed.
17 Citations
8 Claims
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1. A power semiconductor device, comprising:
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a semiconductor body of a first conductivity type; a plurality of trenches along a surface of said semiconductor body and extending to a first depth of said semiconductor body; a gate oxide layer lining surfaces of each of said plurality of trenches; a gate electrode within each of said plurality of trenches, each gate electrode including a free end extending above the surface of said semiconductor body; and a plurality of ultra-shallow source regions of said first conductivity type within said semiconductor body and extending to a second depth of said semiconductor body, wherein said second depth is approximately equal to or less than a thickness of said gate oxide layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification