Apparatus and method for performing a four-point voltage measurement for an integrated circuit

• US 7,218,125 B2
• Filed: 09/30/2005
• Issued: 05/15/2007
• Est. Priority Date: 09/30/2005
• Status: Expired due to Fees

• Current Assignee: Avago Technologies International Sales Pte Limited (Broadcom, Inc.)
• Original Assignee: Agere Systems Incorporated (Broadcom, Inc.)
• Inventors: Petrie, Neil, Connolly, Barrett L., Micko, Gregory P., Fitzgerald, David John
• Primary Examiner(s): Hirshfeld; Andrew H.
• Assistant Examiner(s): Dole; Timothy J
• Application Number:
  US11/241,823
• Publication Number:
  US 20070075712A1
• Time in Patent Office: 592 Days
• Field of Search: 324/713, 324/715, 324/719, 324/691, 324/724
• US Class Current: 324/715
• CPC Class Codes: G01R 31/2884 using dedicated test connectors, test elements or test circuits on the IC under test G01R31/2855 takes precedence
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06

Abstract

A method and apparatus for determining a voltage, such as a bias voltage, supplied by an integrated circuit. A nominal terminating resistor is connected across a first and a second input/output pads from which the voltage is supplied. The voltage is measured across third and fourth pads connected, respectively, to the first and second pads. In an alternative embodiment the functionality of the third and the fourth pads is multiplexed between chip operational circuitry unrelated to the voltage to be measured and a connection to the first and second pads for measuring the voltage.

Claims

1. A test apparatus for measuring a signal generated on an integrated circuit by a source during a testing mode, wherein the signal is supplied to first and second bond pads of the integrated circuit, and wherein during an operational mode an operational component is connected to the first and second bond pads, the test apparatus comprising:

first and second conductive elements for connecting the first and the second bond pads to a resistive element having a value related to a value of the operational component;

a measuring device; and

third and fourth conductive elements for connecting the measuring device to third and fourth bond pads of the integrated circuit responsive to the source through first and second switching elements.

2. The apparatus of claim 1 wherein the resistive element comprises a nominal resistance of a disk drive storage system read head.

3. The apparatus of claim 1 wherein the signal comprises a bias voltage for biasing a read head of a disk drive storage system.

4. The apparatus of claim 1 wherein the signal comprises a bias current for biasing the read head of a disk drive storage system.

5. The apparatus of claim 1 wherein the first, the second, the third and the fourth conductive elements comprise a first, a second, a third and a fourth test probe.

6. The apparatus of claim 1 wherein internal resistance of the measuring device is so large relative to a contact resistance associated with operation of the test apparatus that a measured signal measured by the test apparatus is insensitive to contact resistance.

7. The apparatus of claim 6 wherein influence of contact resistance on signal measurement introduces less than 1 percent error.

8. The apparatus of claim 1 wherein the integrated circuit further comprises a first and a second circuit element each configurable to an operable or a non-operable state and connected to the third and the fourth bond pads, respectively, the first switching element is disposed between a first terminal of the source and the third bond pad, and the second switching element is disposed between a second terminal of the source and the fourth bond pad, wherein in the operational mode the first and the second circuit elements are configured to the operable state and the first and the second switching elements are switched to an open state, and wherein in the testing mode the first and the second circuit elements are configured to the non-operable state and the first and the second switching elements are switched to a closed state to connect the source across the third and the fourth bond pads.

9. The apparatus of claim 8 wherein the first and the second circuit elements comprise a first and a second output driver.

10. The apparatus of claim 8 wherein the first and the second switching elements each comprises a metal oxide semiconductor field effect transistor each having a gate, each gate for receiving a control signal to switch the first and the second transistors to the opened state or to the closed state.

11. The apparatus of claim 1 wherein the measuring device comprises a first measuring device for measuring a first signal between the third bond pad and ground and a second measuring device for measuring a second signal between the fourth bond pad and ground, wherein the signal generated on the integrated circuit comprises a sum of the first and the second signals.

12. The apparatus of claim 1 wherein the measuring device comprises a measuring device for measuring the signal between the third and the fourth bond pads, and wherein the signal represents the signal generated on the integrated circuit.

13. A method for measuring a signal generated by a source disposed on an integrated circuit during a test, wherein the signal is supplied to first and second bond pads of the integrated circuit, and wherein during an operating mode an operational component is connected across the first and second bond pads, the method comprising:

connecting a resistive element having a value related to a value of the operational component across the first and the second bond pads; and

connecting a measuring device to third and fourth bond pads of the integrated circuit responsive to the source through first and second switching elements to determine a measured signal.

14. The method of claim 13 further comprising:

switching the first and the second switching elements to a closed configuration to connect the source to the third and the fourth bond pads.

15. The method of claim 13 wherein the step of connecting the measuring device further comprises:

connecting the measuring device to the third integrated circuit bond pad to determine a first referenced signal with respect to a reference;

connecting the measuring device to the fourth integrated circuit bond pad to determine a second referenced signal with respect to the reference; and

combining the first and the second referenced signals to determine the measured signal.

16. The method of claim 13 wherein the step of connecting the measuring device comprises connecting the measuring device across the third and fourth integrated circuit bond pads to determine the measured signal.

17. The method of claim 13 wherein the resistive element comprises a resistive element having a resistance of a disk drive storage system read head.

18. The method of claim 13 wherein the step of connecting the measuring device further comprises connecting a first terminal of the measuring device to the third bond pad through a first test probe and connecting a second terminal of the measuring device to the fourth bond pad through a second test probe, wherein a resistance of the measuring device is greater than a contact resistance of both the first and the second test probes.

19. The method of claim 13 further comprising:

determining a signal across the resistive element; and

determining a contact resistance of the first and the second test probes from the signal across the resistive element and the measured signal.