Thermal management arrangement with a low heat flux channel flow coupled to high heat flux channels

• US 7,218,519 B2
• Filed: 06/15/2004
• Issued: 05/15/2007
• Est. Priority Date: 06/15/2004
• Status: Expired due to Fees

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Chrysler, Gregory M., Prasher, Ravi S.
• Primary Examiner(s): Datskovsky; Michael
• Assistant Examiner(s): HOFFBERG, ROBERT JOSEPH
• Application Number:
  US10/869,186
• Publication Number:
  US 20050276014A1
• Time in Patent Office: 1,064 Days
• Field of Search: 361698-702, 361717-718, 257714-715, 165/80.4, 165/80.5, 165/104.33, 165/165
• US Class Current: 361/700
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Embodiments of the present invention include an apparatus, method, and system for a thermal management arrangement having a low heat flux channel flow coupled to high heat flux channels.

Claims

1. An apparatus comprising:

a cooling channel to correspond to a first area of a semiconductor package having a first heat flux, the cooling channel having a hydraulic diameter and length configured to facilitate single-phase flow;

a plurality of other cooling channels to correspond to a second area of the semiconductor package having a second heat flux that is greater than the first heat flux, each of the plurality of other cooling channels having a hydraulic diameter similar to one another and being arranged in parallel with one another, the plurality of other channels having hydraulic diameters and lengths configured to facilitate two-phase flow; and

the cooling channel to be flow coupled to the plurality of other cooling channels.

2. The apparatus of claim 1, wherein the cooling channel forms a serpentine pattern through the first area.

3. The apparatus of claim 1, further comprising:

a first inlet to be directly flow coupled to the cooling channel.

4. The apparatus of claim 3, further comprising:

a first outlet to be directly flow coupled to the plurality of other cooling channels.

5. The apparatus of claim 4, further comprising:

another cooling channel to correspond to the first area.

6. The apparatus of claim 5, wherein the first inlet is directly flow coupled to the another cooling channel.

7. The apparatus of claim 5, further comprising:

a second inlet to be directly flow coupled to the another cooling channel.

8. The apparatus of claim 5, wherein the another cooling channel is flow coupled to the plurality of other cooling channels to provide fluid to the plurality of other cooling channels.

9. The apparatus of claim 5, further comprising:

another plurality of other cooling channels, separate from the plurality of other cooling channels, to correspond to a third area having a third heat flux; and

the another cooling channel to be flow coupled to the another plurality of cooling channels.

10. The apparatus of claim 9, wherein the another plurality of other cooling channels are flow coupled to the first outlet.

11. The apparatus of claim 9, further comprising:

a second outlet; and

the another plurality of other cooling channels to be flow coupled to the second outlet.

12. The apparatus of claim 9, wherein the third heat flux is greater than the first heat flux.

13. The apparatus of claim 1, wherein the cooling channel is flow coupled to the plurality of other channels in a manner parallel to the plurality of other channels.

14. A method comprising:

providing a first fluid flow for cooling a first area of a semiconductor package having a first heat flux, the first fluid flow being a single-phase flow; and

dividing at least a portion of the first fluid flow into second and third fluid flows for cooling a second area of the semiconductor package having a second heat flux that is greater than the first heat flux, the second and third fluid flows being two-phase flows with development from the single-phase flow into the two-phase flows occurring at or about the division of at least the portion of the first fluid flow into the second and third fluid flows.

15. The method of claim 14, further comprising:

absorbing at least a portion of the first heat flux in the first fluid flow; and

absorbing at least a portion of the second heat flux in the second and third fluid flows.

16. The method of claim 15, further comprising:

transferring at least a portion of the absorbed heat of the first and second fluid flows to a remote heat exchanger.

17. The method of claim 14, further comprising:

providing a fourth fluid flow for the first area as a single-phase flow.

18. The method of claim 17, further comprising:

dividing at least a portion of the fourth cooling fluid flow into the second and third fluid flows.

19. The method of claim 14, further comprising:

providing a fifth and a sixth fluid flows, separate from the second and third fluid flows, for a third area of the semiconductor package with a third heat flux that is greater than the first heat flux; and

the fifth and sixth fluid flows being two-phase flows and including at least a portion of the fourth cooling flow.

20. A system comprising:

a semiconductor package having an integrated circuit, a first area having a first heat output, and a second area having a second heat output greater than the first heat output;

thermal management arrangement to facilitate the dissipation of heat from the semiconductor package including

a cooling channel thermally coupled to the first area and having a hydraulic diameter and length configured to facilitate single-phase flow; and

a plurality of other channels thermally coupled to the second area and having hydraulic diameters and lengths configured to facilitate two-phase flow, the hydraulic diameters of the plurality of other cooling channels being similar to one another and arranged in parallel to one another;

the cooling channel being flow coupled to the plurality of other cooling channels; and

a mass storage device coupled to the semiconductor package.

21. The system of claim 20, wherein the thermal management arrangement further comprises:

an inlet, directly flow coupled to the cooling channel; and

an outlet, directly flow coupled to the plurality of other cooling channels.

22. The system of claim 21, wherein the thermal management arrangement further comprises:

a pump coupled to the inlet; and

a heat exchanger coupled to the outlet.

23. The system of claim 20, further comprising:

a dynamic random access memory coupled to the integrated circuit; and

an input/output interface coupled to the integrated circuit.

24. The system of claim 23, wherein the input/output interface comprises a networking interface.

25. The system of claim 20, wherein the first area of the semiconductor package includes core logic of the integrated circuit and the second area of the semiconductor package includes a cache of the integrated circuit.

26. The system of claim 20, wherein the integrated circuit is a processor.

27. The system of claim 26, wherein the system is a selected one of a group consisting of a set-top box, a media-center personal computer, and a digital versatile disk player.

28. The system of claim 20, wherein the cooling channel is flow coupled to the plurality of other channels in a manner parallel to the plurality of other channels.