Heat dissipation system with an air compressing mechanism

• US 7,219,504 B2
• Filed: 02/09/2005
• Issued: 05/22/2007
• Est. Priority Date: 02/09/2005
• Status: Expired due to Fees

• Current Assignee: Wonten Technology Co., Ltd.
• Original Assignee: Egbon Electronics Ltd.
• Inventors: Chen, Wan-Tien
• Primary Examiner(s): Ali; Mohammad M.
• Application Number:
  US11/053,241
• Publication Number:
  US 20060174636A1
• Time in Patent Office: 832 Days
• Field of Search: 62/86, 624/01, 624/02, 622/592, 165/104.33, 361/679, 361/690
• US Class Current: 62/86
• CPC Class Codes: F25B 9/004 the refrigerant being air
• CPC Class Codes: H01L 23/467 by flowing gases, e.g. air H01L23/473 takes precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A heat dissipation system, including an air compressor mechanism disposed in a body shell, which has an inlet and enlarged outlet. An air is directed to the air compressor mechanism, and compressed. Upon exhaling the body shell, a compressed air will rapidly expand and a heat generated from electrical appliances installed thereunder will be reduced to a functional level. The system is applicable for the heat dissipating to computer devices, electronic appliances, or heat producing devices.

Claims

1. A heat dissipation system for removing heat from computers and electronic appliances, said system comprising

a shell body having a top and a bottom and an air inlet located on said top and an enlarged outlet located on said bottom;

and

a micro air compressor mechanism having first and second ends, disposed within said shell body with one end attached to said air inlet and said second end directed to said outlet, so that air enters via said inlet and is pressurized by said micro air compressor mechanism; and

is exhausted by said micro air compressor mechanism via the outlet to expand rapidly with an increasing air flow and decreasing temperature to thereby dissipate heat from a heat- generating body positioned thereunder.

2. A heat dissipation system for removing heat from computers and electronic appliances, said system comprising.

a shell body having a top and a bottom and an air inlet located on said top and an enlarged outlet located on said bottom;

a micro air compressor mechanism having first and second ends, disposed within said shell body with one end attached to said air inlet and said second end directed to said outlet, so that air enters via said inlet and is pressurized by said micro air compressor mechanism; and

is exhausted by said micro air compressor mechanism via the outlet to expand rapidly with an increasing air flow and decreasing temperature to thereby dissipate heat from a heat-generating body positioned thereunder; and

wherein a pipe has one end connected to the outlet of the shell body and the other end opened for directly exhaling the rapidly expanded air to the heat-generating body.

3. The heat dissipation system as claimed in claim 2, further comprising a heat exchanger to cool the air in the air compressor mechanism.

4. The heat dissipation system as claimed in claim 2, further including a heat dissipation device, which comprises a plurality of fins installed between the shell body and the heat-generating body.