Advanced finishing control
First Claim
1. An apparatus comprising:
- a finishing surface;
a mechanism for applying an operative finishing motion for finishing a workpiece; and
at least one operative connection connecting the apparatus to an at least one processor, an at least one operative sensor for sensing an in situ finishing information, an at least one controller for controlling the apparatus, and an at least one processor readable memory device that includes;
(i) at least in part an in-process cost of manufacture information,(ii) the in situ finishing information, and(iii) encoded instructions that when executed by the at least one processor determines a process control for the at least one controller with the at least in part an in-process cost of manufacture information and the in situ finishing information.
3 Assignments
0 Petitions
Accused Products
Abstract
An apparatus and method of using an in situ finishing information for finishing workpieces and semiconductor wafers are described. The method uses operative sensors such as friction sensors for detecting and improving control during finishing. The method can aid control of finishing while using in situ finishing information and cost of manufacture information. The method can aid control of finishing while using organic lubricants, lubricating films, and lubricating boundary layers in the operative finishing interface. The method can generally aid control of differential finishing such as when using differential lubricating films such as lubricating boundary layers. Control can generally aid improvement of differential finishing of workpieces such as semiconductor wafers. Planarization and localized finishing can be used with in situ finishing information such as differential lubricating boundary layer(s) for finishing. Defects can generally be reduced using in situ finishing information such as friction information and/or cost information. In situ improvements to cost of manufacture of a workpiece such as a semiconductor wafer using tracking and using in-process cost of manufacture information and/or cost of manufacture parameters are discussed. In situ improvements to cost of manufacture of a workpiece such as a semiconductor wafer using tracking and using in-process tracked information and/or cost of manufacture parameters are discussed. Methods and apparatus to change and/or improve in situ process control are discussed. Methods and apparatus to change and/or improve real-time process control are discussed. The semiconductor wafers can be tracked individually or by process group such as a process batch. Abrasive finishing surfaces can be used. Tribochemical finishing can generally be improved.
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Citations
20 Claims
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1. An apparatus comprising:
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a finishing surface; a mechanism for applying an operative finishing motion for finishing a workpiece; and at least one operative connection connecting the apparatus to an at least one processor, an at least one operative sensor for sensing an in situ finishing information, an at least one controller for controlling the apparatus, and an at least one processor readable memory device that includes; (i) at least in part an in-process cost of manufacture information, (ii) the in situ finishing information, and (iii) encoded instructions that when executed by the at least one processor determines a process control for the at least one controller with the at least in part an in-process cost of manufacture information and the in situ finishing information. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method of finishing of a workpiece having a workpiece surface comprising:
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providing a finishing surface; positioning the workpiece surface proximate to the finishing surface; providing at least one operative sensor; applying an operative finishing motion between the workpiece surface and the finishing surface; sensing an in situ finishing information with the at least one operative sensor and sending the in situ finishing information to an at least one processor; evaluating at least one process control parameter for adjustment using; i) the at least one processor, ii) an at least in part a in-process cost of manufacture information, and iii) the in situ finishing information; and controlling the at least one process control parameter to change the finishing of the workpiece using the at least in part the in-process cost of manufacture information. - View Dependent Claims (8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A method for finishing a workpiece comprising:
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(A) providing a workpiece having a workpiece surface and wherein the workpiece surface has a first uniform region and a second uniform region; (B) providing a finishing surface; (C) providing at least three operative process sensors, an at least one processor, and a controller; (D) applying an operative finishing motion to an interface between the workpiece surface and the finishing surface and wherein the interface includes the first uniform region; (E) sensing an in situ finishing information during finishing with the at least three operative process sensors during a finishing cycle time; (F) evaluating a multiplicity of finishing information, and at least a plurality of the multiplicity of the finishing information have an effect on a cost of manufacture of the workpiece; (G) determining a change for at least one process control parameter using; (i) the at least one processor, (ii) an at least in part a tracked information, (iii) an at least in part a tracked current in-processs cost of manufacture information, (iv) the in situ finishing information, and (v) the (F) of evaluating the multiplicity of finishing information; and (H) changing the at least one control parameter to change the finishing the workpiece surface in at least the first uniform region during the finishing cycle time; (I) storing at a least a portion of the information in the (G) forming a family of stored information; (J) using at least in part the family of stored information to determine a change for an at least one particular member of the family of stored information; (K) changing the at least one particular member in the family of stored information forming a changed family of stored information; and (L) using the changed family of stored information. - View Dependent Claims (18, 19, 20)
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Specification