Advanced finishing control

• US 7,220,164 B1
• Filed: 11/06/2006
• Issued: 05/22/2007
• Est. Priority Date: 12/08/2003
• Status: Expired due to Fees

• Current Assignee: Semcon Tech LLC (IPNav)
• Original Assignee: Beaver Creek Concepts, Inc.
• Inventors: Molnar, Charles J.
• Primary Examiner(s): Wilson, Lee D.
• Assistant Examiner(s): OJINI, EZIAMARA ANTHONY
• Application Number:
  US11/593,307
• Time in Patent Office: 197 Days
• Field of Search: 451 4- 11, 451/36, 451/41, 451/60, 451/63, 451285-290, 451/449, 438690-693, 216/38, 216 88- 91, 252/79.1
• US Class Current: 451/8
• CPC Class Codes: B24B 37/013 Devices or means for detecting lapping completion
• CPC Class Codes: B24B 37/042 operating processes therefor

Abstract

An apparatus and method of using an in situ finishing information for finishing workpieces and semiconductor wafers are described. The method uses operative sensors such as friction sensors for detecting and improving control during finishing. The method can aid control of finishing while using in situ finishing information and cost of manufacture information. The method can aid control of finishing while using organic lubricants, lubricating films, and lubricating boundary layers in the operative finishing interface. The method can generally aid control of differential finishing such as when using differential lubricating films such as lubricating boundary layers. Control can generally aid improvement of differential finishing of workpieces such as semiconductor wafers. Planarization and localized finishing can be used with in situ finishing information such as differential lubricating boundary layer(s) for finishing. Defects can generally be reduced using in situ finishing information such as friction information and/or cost information. In situ improvements to cost of manufacture of a workpiece such as a semiconductor wafer using tracking and using in-process cost of manufacture information and/or cost of manufacture parameters are discussed. In situ improvements to cost of manufacture of a workpiece such as a semiconductor wafer using tracking and using in-process tracked information and/or cost of manufacture parameters are discussed. Methods and apparatus to change and/or improve in situ process control are discussed. Methods and apparatus to change and/or improve real-time process control are discussed. The semiconductor wafers can be tracked individually or by process group such as a process batch. Abrasive finishing surfaces can be used. Tribochemical finishing can generally be improved.

Claims

1. An apparatus comprising:

a finishing surface;

a mechanism for applying an operative finishing motion for finishing a workpiece; and

at least one operative connection connecting the apparatus to an at least one processor, an at least one operative sensor for sensing an in situ finishing information, an at least one controller for controlling the apparatus, and an at least one processor readable memory device that includes;

(i) at least in part an in-process cost of manufacture information,

(ii) the in situ finishing information, and

(iii) encoded instructions that when executed by the at least one processor determines a process control for the at least one controller with the at least in part an in-process cost of manufacture information and the in situ finishing information.

2. The apparatus of claim 1 wherein the at least one processor readable memory device additionally includes a model for predictive control.

3. The apparatus of claim 1 wherein the in-process cost of manufacture information comprises at least in part a tracked in-process cost of manufacture information.

4. The apparatus of claim 1 wherein the in-process cost of manufacture information comprises at least in part a tracked and updated in-process cost of manufacture information.

5. The apparatus of claim 4 wherein the apparatus is connected to a multiplicity of other workpiece fabrication machinery, and information derived therefrom in an operative computerized network, the control subsystem operatively connected with the other workpiece fabrication machinery, metrology equipment, and information derived therefrom for feedforward and feedback control.

6. The apparatus of claim 1 wherein the apparatus is connected to a multiplicity of other workpiece fabrication machinery, and information derived therefrom in an operative computerized network, the control subsystem operatively connected with the other workpiece fabrication machinery, metrology equipment, and information derived therefrom for feedforward and feedback control for changing the process control.

7. A method of finishing of a workpiece having a workpiece surface comprising:

providing a finishing surface;

positioning the workpiece surface proximate to the finishing surface;

providing at least one operative sensor;

applying an operative finishing motion between the workpiece surface and the finishing surface;

sensing an in situ finishing information with the at least one operative sensor and sending the in situ finishing information to an at least one processor;

evaluating at least one process control parameter for adjustment using;

i) the at least one processor,

ii) an at least in part a in-process cost of manufacture information, and

iii) the in situ finishing information; and

controlling the at least one process control parameter to change the finishing of the workpiece using the at least in part the in-process cost of manufacture information.

8. A processor-readable, program storage device encoded with instructions that, when executed by a processor, performs the method of claim 7.

9. A control subsystem having access to a manufactured article having a processor readable medium with processor readable instructions for performing the method of claim 7.

10. An apparatus for finishing a workpiece having a subsystem controller, the subsystem controller having access to a manufactured article having a computer readable medium with computer readable instructions for performing the method of claim 7.

11. The apparatus of claim 10 additionally including an at least one processor readable memory device including a model for predictive control.

12. The method of claim 7 wherein the in-process cost of manufacture information comprises a tracked current in-processs cost of manufacture information.

13. A processor-readable, program storage device encoded with instructions that, when executed by a processor, performs the method of claim 12.

14. The method of claim 7 wherein the workpiece comprises a workpiece having different compositions exposed on its surface during the method of finishing.

15. A processor-readable, program storage device encoded with instructions that, when executed by a processor, performs the method of claim 14.

16. The method of claim 12 wherein the workpiece comprises a semiconductor wafer having a diameter of at least 300 millimeters and wherein (L) using the changed family of stored information comprises using the changed family of stored information for at least in part determining a change for a process model.

17. A method for finishing a workpiece comprising:

(A) providing a workpiece having a workpiece surface and wherein the workpiece surface has a first uniform region and a second uniform region;

(B) providing a finishing surface;

(C) providing at least three operative process sensors, an at least one processor, and a controller;

(D) applying an operative finishing motion to an interface between the workpiece surface and the finishing surface and wherein the interface includes the first uniform region;

(E) sensing an in situ finishing information during finishing with the at least three operative process sensors during a finishing cycle time;

(F) evaluating a multiplicity of finishing information, and at least a plurality of the multiplicity of the finishing information have an effect on a cost of manufacture of the workpiece;

(G) determining a change for at least one process control parameter using;

(i) the at least one processor,

(ii) an at least in part a tracked information,

(iii) an at least in part a tracked current in-processs cost of manufacture information,

(iv) the in situ finishing information, and

(v) the (F) of evaluating the multiplicity of finishing information; and

(H) changing the at least one control parameter to change the finishing the workpiece surface in at least the first uniform region during the finishing cycle time;

(I) storing at a least a portion of the information in the (G) forming a family of stored information;

(J) using at least in part the family of stored information to determine a change for an at least one particular member of the family of stored information;

(K) changing the at least one particular member in the family of stored information forming a changed family of stored information; and

(L) using the changed family of stored information.

18. A processor-readable, program storage device encoded with instructions that, when executed by a processor, performs the method of claim 17.

19. A control subsystem having access to a manufactured article having a processor readable medium with processor readable instructions for performing the method of claim 17.

20. An apparatus for finishing a semiconductor wafer having a subsystem controller, the subsystem controller having access to a manufactured article having a computer readable medium with computer readable instructions for performing the method of claim 17.