Single-pole component manufacturing
First Claim
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1. A method of manufacturing a single-pole component of vertical type in a silicon substrate of a first conductivity type, comprising the steps of:
- a) forming openings in a thick silicon layer of the first conductivity type covering the substrate, the thick silicon layer being more lightly doped than the substrate;
b) coating walls and bottoms of the openings with a silicon oxide layer;
c) forming, by implantation/diffusion through the bottoms of the openings, regions of a second conductivity type opposite to that of the substrate; and
d) filling the openings with an insulating material.
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Abstract
The invention relates to a vertical-type single-pole component, comprising regions with a first type of conductivity which are embedded in a thick layer with a second type of conductivity. Said regions are distributed over at least one same horizontal level and are independent of each other. The regions also underlie an insulating material.
8 Citations
15 Claims
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1. A method of manufacturing a single-pole component of vertical type in a silicon substrate of a first conductivity type, comprising the steps of:
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a) forming openings in a thick silicon layer of the first conductivity type covering the substrate, the thick silicon layer being more lightly doped than the substrate; b) coating walls and bottoms of the openings with a silicon oxide layer; c) forming, by implantation/diffusion through the bottoms of the openings, regions of a second conductivity type opposite to that of the substrate; and d) filling the openings with an insulating material. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of making a single pole component, comprising:
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providing a substrate of a first conductivity type; providing a layer of the first conductivity type on the substrate, the layer being more lightly doped than the substrate; forming first openings that extend into the layer from an upper surface thereof; coating the first openings with an insulating layer; penetrating the layer at bottom surfaces of the first openings to form first buried regions of a second conductivity different than the first conductivity; and filling the first openings with an insulating material to form columns of insulating material. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15)
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Specification