H2 plasma treatment
First Claim
1. A method for forming an electronic device comprising:
- forming a first conductive layer in an opening in a dielectric structure supported by a substrate, the first conductive layer being an adhesion/barrier layer;
depositing a seed layer on the first conductive layer;
forming a core conductive layer on the seed layer, the core conductive layer substantially including one or more of aluminum, silver, or gold;
subjecting the core conductive layer to a H2 plasma treatment; and
depositing a capping layer on the core conductive layer after the H2 plasma treatment.
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Accused Products
Abstract
Electronic devices are constructed by a method that includes forming a first conductive layer in an opening in a multilayer dielectric structure supported by a substrate, forming a core conductive layer on the first conductive layer, subjecting the core conductive layer to a H2 plasma treatment, and depositing a capping adhesion/barrier layer on the core conductive layer after the H2 plasma treatment. The multilayer dielectric structure provides an insulating layer for around the core conducting layer and at least one sacrificial layer for processing. The H2 plasma treatment removes unwanted oxide from the surface region of the core conducting layer such that the interface between the core conducting layer and the capping adhesion/barrier is substantially free of oxides. In an embodiment, the core conducting layer is copper with a titanium nitride or zirconium capping adhesion/barrier layer.
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Citations
60 Claims
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1. A method for forming an electronic device comprising:
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forming a first conductive layer in an opening in a dielectric structure supported by a substrate, the first conductive layer being an adhesion/barrier layer; depositing a seed layer on the first conductive layer; forming a core conductive layer on the seed layer, the core conductive layer substantially including one or more of aluminum, silver, or gold; subjecting the core conductive layer to a H2 plasma treatment; and depositing a capping layer on the core conductive layer after the H2 plasma treatment. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 58, 59, 60)
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13. A method for forming an integrated circuit comprising:
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forming one or more device structures on a substrate; forming a polyimide layer above a number of first level vias provided for electrical coupling to at least one of the one or more device structures; forming a number of trenches in the polyimide layer; forming a first conductive layer in the number of trenches, the first conductive layer being an adhesion/barrier layer; depositing a seed layer on the first conductive layer; depositing a core conductive layer on the seed layer, the core conductive layer substantially including one or more of aluminum, silver, or gold; subjecting the core conductive layer to a H2 plasma treatment; and depositing a capping layer on the conductive layer after the H2 plasma treatment. - View Dependent Claims (14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26)
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27. A method for forming an integrated circuit comprising:
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forming one or more device structures on a substrate; forming a first oxide layer above a number of first level vias for electrical coupling to at least one of the one or more device structures; forming a number of trenches in the first oxide layer; forming a first conductive layer in the number of trenches, the first conductive layer being an adhesion/barrier layer; depositing a seed layer on the first conductive layer; depositing a core conductive layer on the seed layer, the core conductive layer substantially including one or more of aluminum, silver, or gold; subjecting the core conductive layer to a H2 plasma treatment; and depositing a capping layer on the core conductive layer after the H2 plasma treatment. - View Dependent Claims (28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39)
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40. A method of forming a memory device comprising:
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forming an array of memory cells in a substrate; and forming a wiring structure in the substrate coupling to the array of memory cells, at least a portion of the wiring structure formed by a method including; forming a first conductive layer in an opening in a multilayer dielectric structure supported by a substrate, the first conductive layer being an adhesion/barrier layer; depositing a seed layer on the first conductive layer; forming a core conductive layer on the seed layer, the core conductive layer substantially including one or more of aluminum, silver, or gold; subjecting the core conductive layer to a H2 plasma treatment; and depositing a capping layer on the core conductive layer after the H2 plasma treatment, the capping layer being a conductive adhesion/barrier layer. - View Dependent Claims (41, 42, 43, 44, 45, 46, 47)
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48. A method of forming an electronic system comprising:
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providing a controller; coupling the controller to one or more integrated circuits, at least the controller or one integrated circuit having a wiring structure on a substrate, at least a portion of the wiring structure formed by a method including; forming a first conductive layer in an opening in a multilayer dielectric structure supported by a substrate, the first conductive layer being an adhesion/barrier layer; depositing a seed layer on the first conductive layer; forming a core conductive layer on the seed layer, the core conductive layer substantially including one or more of aluminum, silver, or gold; subjecting the core conductive layer to a H2 plasma treatment; and depositing a capping layer on the core conductive layer after the H2 plasma. - View Dependent Claims (49, 50, 51, 52, 53, 54, 55, 56, 57)
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Specification