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H2 plasma treatment

  • US 7,220,665 B2
  • Filed: 08/05/2003
  • Issued: 05/22/2007
  • Est. Priority Date: 08/05/2003
  • Status: Active Grant
First Claim
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1. A method for forming an electronic device comprising:

  • forming a first conductive layer in an opening in a dielectric structure supported by a substrate, the first conductive layer being an adhesion/barrier layer;

    depositing a seed layer on the first conductive layer;

    forming a core conductive layer on the seed layer, the core conductive layer substantially including one or more of aluminum, silver, or gold;

    subjecting the core conductive layer to a H2 plasma treatment; and

    depositing a capping layer on the core conductive layer after the H2 plasma treatment.

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