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Dual band power amplifier module for wireless communication devices

  • US 7,221,225 B2
  • Filed: 07/02/2005
  • Issued: 05/22/2007
  • Est. Priority Date: 12/03/2004
  • Status: Active Grant
First Claim
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1. A power amplifier module for amplifying radio frequency signals, comprising:

  • a) one or more radio frequency power amplifiers each including one or more semiconductor transistors, adapted to receive an input radio frequency signal and a processed power-sensing control signal, and to output an amplified radio frequency signal;

    b) one or more power-sensing circuits each coupled to said one or more radio frequency power amplifiers and adapted to receive each amplified radio frequencyc) a substrate wherein each side of the substrate is approximately 4 millimeters, wherein the substrate comprises a thickness of approximately 1 millimeter and wherein the substrate includes a plurality of pads positioned around the perimeter of the substrate, each pad having a pitch of about 0.65 millimeter, a width of about 0.23 millimeter, and a length of about 0.4 millimeter.

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