Radio frequency identification tag and method of making the same
First Claim
1. A radio frequency identification (RFID) tag comprising:
- a substrate material;
an antenna disposed on the substrate;
a die positioning structure disposed on the substrate and defining a cavity for receiving a silicon die; and
a silicon die disposed in the die positioning structure, and in contact with the die positioning structure, the silicon die having at least one bond for connecting to the antenna.
2 Assignments
0 Petitions
Accused Products
Abstract
The present invention describes a process for manufacture of RFID tags. The RFID tag of the present invention includes a substrate, an antenna, and a die positioning structure disposed on the substrate that is cast and cured specifically for receiving a silicon die of the type typically used in RFID applications. The substrate is selected from a number of materials, the properties of which render it penetrable by electron beam radiation. The die positioning structure is a second material which is electron beam curable, and which is deposited and cured at high speed on the substrate in a novel fashion in accordance with the present invention in a highly efficient, reproducible and economical manner.
-
Citations
51 Claims
-
1. A radio frequency identification (RFID) tag comprising:
-
a substrate material; an antenna disposed on the substrate; a die positioning structure disposed on the substrate and defining a cavity for receiving a silicon die; and a silicon die disposed in the die positioning structure, and in contact with the die positioning structure, the silicon die having at least one bond for connecting to the antenna. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 30, 31, 32, 33, 34, 35, 36, 37)
-
-
26. A method of manufacture for a radio frequency identification (RFID) tag, the method comprising:
-
providing a substrate; providing an antenna preformed on the substrate; providing a second material; providing a negative cast of a die positioning structure; pressing the second material between the substrate and the negative cast, thereby providing a die positioning structure; curing the second material, thereby providing a cured die positioning structure; and affixing a silicon die within the cured die positioning structure, such that the silicon die is in contact with the cured die positioning structure. - View Dependent Claims (27, 28, 29, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51)
-
Specification