System and method for monitoring manufacturing apparatuses
First Claim
1. A system for monitoring manufacturing apparatuses, comprising:
- a manufacturing information input unit configured to acquire time series data of apparatus parameters controlling a plurality of manufacturing apparatuses, the manufacturing apparatuses performing a sequence of manufacturing processes on wafers so as to manufacture semiconductor devices;
a failure pattern classification unit configured to classify in-plane distributions of failures in each of the wafers into failure patterns;
an index calculation unit configured to statistically process the time series data by a plurality of algorithms so as to calculate a plurality of indices corresponding to the respective algorithms;
an index analysis unit configured to provide first and second frequency distributions of the indices and to implement a significance test between the first and second frequency distributions, the first and second frequency distributions being categorized with and without a target failure pattern, respectively;
an abnormal parameter extraction unit configured to extract a failure cause index of the target failure pattern by comparing a value of the significance test with a test reference value; and
a plurality of real-time monitor units configured to monitor operation of the manufacturing apparatuses by referring to the failure cause index.
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Abstract
A control system for a manufacturing apparatus includes manufacturing information input unit acquiring time series data of apparatus parameters controlling manufacturing apparatuses; failure pattern classification module classifying in-plane distributions of failures of each of the wafers into failure patterns; an index calculation unit configured to statistically process the time series data by algorithms to calculate indices corresponding to the respective algorithms; an index analysis unit providing first and second frequency distributions of the indices categorized with and without the target failure pattern, to implement significance test between the first and second frequency distributions; and an abnormal parameter extraction unit extracting failure cause index of failure pattern by comparing value of the significance test with test reference value.
27 Citations
9 Claims
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1. A system for monitoring manufacturing apparatuses, comprising:
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a manufacturing information input unit configured to acquire time series data of apparatus parameters controlling a plurality of manufacturing apparatuses, the manufacturing apparatuses performing a sequence of manufacturing processes on wafers so as to manufacture semiconductor devices; a failure pattern classification unit configured to classify in-plane distributions of failures in each of the wafers into failure patterns; an index calculation unit configured to statistically process the time series data by a plurality of algorithms so as to calculate a plurality of indices corresponding to the respective algorithms; an index analysis unit configured to provide first and second frequency distributions of the indices and to implement a significance test between the first and second frequency distributions, the first and second frequency distributions being categorized with and without a target failure pattern, respectively; an abnormal parameter extraction unit configured to extract a failure cause index of the target failure pattern by comparing a value of the significance test with a test reference value; and a plurality of real-time monitor units configured to monitor operation of the manufacturing apparatuses by referring to the failure cause index. - View Dependent Claims (2)
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3. A system for monitoring manufacturing apparatuses, comprising:
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a manufacturing information input unit configured to acquire time series data of apparatus parameters controlling a plurality of manufacturing apparatuses, the manufacturing apparatuses performing a sequence of manufacturing processes on wafers so as to manufacture semiconductor devices; a failure pattern classification unit configured to classify in-plane distributions of failures in each of the wafers into failure patterns; an index calculation unit configured to statistically process the time series data by a plurality of algorithms so as to calculate a plurality of indices corresponding to the respect algorithms; an index analysis unit configured to provide first and second frequency distributions of the indices and to implement a significance test between the first and second frequency distributions, the first and second frequency distributions being categorized with and without a target failure pattern, respectively; an abnormal parameter extraction unit configured to extract a failure cause index of the target failure pattern by comparing a value of the significance test with a test reference value; a plurality of real-time monitor units configured to monitor operation of the manufacturing apparatuses by referring to the failure cause index; and a tester server configured to generate failure maps displaying the in-plane distributions based on failures measured by electrical tests of the semiconductor devices, which are performed after a sequence of wafer processes has been completed. - View Dependent Claims (4, 5)
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6. A method for monitoring manufacturing apparatuses, comprising:
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acquiring time series data of apparatus parameters controlling a plurality of manufacturing apparatuses; classifying in-plane distributions of failures of wafers into failure patterns, the wafers processed by the manufacturing apparatuses; statistically processing the time series data by a plurality of algorithms so as to calculate a plurality of indices corresponding to the respective algorithms;
providing first and second frequency distributions of the indices and implementing a significance test between the first and second frequency distributions, the first and second frequency distributions being categorized with and without a target failure pattern, respectively;identifying a failure cause index of the target failure pattern by comparing a value of the significance test with a test reference value; and monitoring operation of the manufacturing apparatuses by referring to the failure cause index. - View Dependent Claims (7, 8, 9)
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Specification